软错误弹性3D片上网络系统的可靠性评估与定量评估
Reliability Assessment and Quantitative Evaluation of Soft-Error Resilient 3D Network-on-Chip Systems
摘要：
三维片上网络（3D-NoC）已经被提出作为一种吉祥的解决方案，其将片上网络（NoC）范例的高并行性与3D-IC的高性能和低功耗成本相结合。然而，随着技术规模的缩小，可靠性问题变得越来越重要，特别是对于复杂的3D-NoC，它提供了多核和众核片上系统的通信要求。可靠性评估在制造过程的早期阶段非常重要，以防止对目标系统进行代价高昂的重新设计。在本文中，我们提出了一个准确的可靠性评估和定量评估的软错误弹性3D-NoC的基础上的软错误弹性机制。该系统可以从路由器的不同流水线级中发生的瞬时错误中恢复。基于这种分析，确定网络的主成分中的故障的影响。
英文摘要：
Three-Dimensional Networks-on-Chips (3D-NoCs) have been proposed as an auspicious solution, merging the high parallelism of the Network-on-Chip (NoC) paradigm with the high-performance and low-power cost of 3D-ICs. However, as technology scales down, the reliability issues are becoming more crucial, especially for complex 3D-NoC which provides the communication requirements of multi and many-core systems-on-chip. Reliability assessment is prominent for early stages of the manufacturing process to prevent costly redesigns of a target system. In this paper, we present an accurate reliability assessment and quantitative evaluation of a soft-error resilient 3D-NoC based on a soft-error resilient mechanism. The system can recover from transient errors occurring in different pipeline stages of the router. Based on this analysis, the effects of failures in the network's principal components are determined.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
