arXivDaily arXiv每日学术速递 周一至周五更新
arXiv周末暂无论文更新,休息一下吧,周末愉快~~
arXiv 1908.03925cs.CRcs.ET
收藏

A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

Satwik Patnaik, Mohammed Ashraf, Ozgur Sinanoglu, Johann Knechtel

英文摘要:

Split manufacturing (SM) and layout camouflaging (LC) are two promising techniques to obscure integrated circuits (ICs) from malicious entities during and after manufacturing. While both techniques enable protecting the intellectual property (IP) of ICs, SM can further mitigate the insertion of hardware Trojans (HTs). In this paper, we strive for the "best of both worlds," that is we seek to combine the individual strengths of SM and LC. By jointly extending SM and LC techniques toward 3D integration, an up-and-coming paradigm based on stacking and interconnecting of multiple chips, we establish a modern approach to hardware security. Toward that end, we develop a security-driven CAD and manufacturing flow for 3D ICs in two variations, one for IP protection and one for HT prevention. Essential concepts of that flow are (i) "3D splitting" of the netlist to protect, (ii) obfuscation of the vertical interconnects (i.e., the wiring between stacked chips), and (iii) for HT prevention, a security-driven synthesis stage. We conduct comprehensive experiments on DRC-clean layouts of multi-million-gate DARPA and OpenCores designs (and others). Strengthened by extensive security analysis for both IP protection and HT prevention, we argue that entering the third dimension is eminent for effective and efficient hardware security.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

↑