polymer基片上金属化线的单调和循环机械可靠性
Monotonic and cyclic mechanical reliability of metallization lines on polymer substrates
摘要：
通过单调拉伸和循环弯曲试验，研究了聚合物衬底上Ag和Cu印刷和蒸发金属化线的机械稳定性。结果表明，在单调测试期间表现出良好性能的线在循环弯曲测试期间在较低应变下失效。具有几百纳米的晶粒尺寸的蒸发线具有良好的延展性，因此在单调加载期间具有良好的稳定性，但同时它们在循环弯曲期间在低应变下失效。相比之下，具有纳米晶微结构的印刷线在单调加载期间表现出更强烈的开裂，但在循环弯曲期间表现出更高的失效应变。除了晶粒尺寸效应外，还证明了薄膜厚度对循环弯曲后饱和裂纹密度的影响。根据剪切滞后模型，薄膜越薄，裂纹密度越高。
英文摘要：
Mechanical stability of Ag and Cu printed and evaporated metallization lines on polymer substrates is investigated by means of monotonic tensile and cyclic bending tests. It is shown that lines which demonstrate good performance during monotonic tests fail at lower strains during a cyclic bending tests. Evaporated lines with the grain size of several hundreds of nanometers have good ductility and consequently good stability during monotonic loading but at the same time they fail at low strains during cyclic bending. Printed lines with nanocrystalline microstructure, in contrast, demonstrate more intensive cracking during monotonic loading but higher failure strains during cyclic bending. Apart from the grain size effect, the effect of film thickness on the saturation crack density after cyclic bending is also demonstrated. Thinner films have higher crack density in accordance with the shear lag model.
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