arXivDaily arXiv每日学术速递 周一至周五更新
arXiv 1612.08014cond-mat.soft
收藏

一种新的流固界面温度跃变模型

A new model for temperature jump at a fluid-solid interface

Jian-Jun Shu, Ji Bin Melvin Teo, Weng Kong Chan

摘要:

提出的问题涉及到一般的流体-固体温度跳跃的一个新的分析模型的发展。据我们所知,没有分析模型可以提供气体和液体系统温度跃变的准确预测。本文在界面相互作用吸附模型的基础上,发展了一个统一的流固温度跃变模型。从该模型获得的结果与文献中的结果进行了验证。

英文摘要:

The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

↑