温差电效应对热电器件性能的影响
Influence of Dimensionality on Thermoelectric Device Performance
摘要：
利用Landauer公式阐明了维数对热电器件电学性能的影响，表明热电系数与传输率T（E）以及传导通道M（E）的能量分布有关。Landauer形式主义适用于从弹道到扩散极限，并提供了一种明确的方式来比较不同维度的性能。它还提供了一个物理解释的“输运分布”，一个数量，出现在玻尔兹曼输运方程的方法。在一维，二维和三维的热电系数的定量比较表明，通道可以更有效地利用在较低的维度。然而，为了实现较低维度的优点，堆积密度必须非常高，因此量子阱或线的厚度必须很小。工程M（E）到一个δ函数的潜在好处也进行了研究。当与体半导体相比时，我们发现其性能有提高约50%的潜力. M（E）的形状随着维数的降低而改善，但是较低的维数本身并不能保证更好的性能，因为它由M（E）的形状和大小控制。设计M（E）的形状的好处似乎是有限的，但增加M（E）的幅度的方法可能会带来巨大的红利。
英文摘要：
The role of dimensionality on the electronic performance of thermoelectric devices is clarified using the Landauer formalism, which shows that the thermoelectric coefficients are related to the transmission, T(E), and how the conducing channels, M(E), are distributed in energy. The Landauer formalism applies from the ballistic to diffusive limits and provides a clear way to compare performance in different dimensions. It also provides a physical interpretation of the "transport distribution," a quantity that arises in the Boltzmann transport equation approach. Quantitative comparison of thermoelectric coefficients in one, two, and three dimension shows that the channels may be utilized more effectively in lower-dimensions. To realize the advantage of lower dimensionality, however, the packing density must be very high, so the thicknesses of the quantum wells or wires must be small. The potential benefits of engineering M(E) into a delta-function are also investigated. When compared to a bulk semiconductor, we find the potential for ~50 % improvement in performance. The shape of M(E) improves as dimensionality decreases, but lower dimensionality itself does not guarantee better performance because it is controlled by both the shape and the magnitude of M(E). The benefits of engineering the shape of M(E) appear to be modest, but approaches to increase the magnitude of M(E) could pay large dividends.
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