移动通信系统用功率半导体模块的热设计
Thermal Design of Power Semiconductor Modules for Mobile Communication Systems
摘要：
我们将描述用于移动通信系统的功率半导体模块的热性能，该模块由异质结双极晶体管（HBT）组成。我们使用有限元法（FEM）计算HBT指和多层印刷电路板（PCB）的底部表面之间的热阻。我们应用稳态分析来评估设计参数对模块热阻的影响。我们发现GaAs衬底的厚度、多层电路板的厚度、GaAs衬底下的键合材料的热导率以及PCB各层之间的热通孔的不对准度是模块热阻的主要参数。
英文摘要：
We will describe the thermal performance of power semiconductor module, which consists of hetero-junction bipolar transistors (HBTs), for mobile communication systems. We calculate the thermal resistance between the HBT fingers and the bottom surface of a multi-layer printed circuit board (PCB) using a finite element method (FEM). We applied a steady state analysis to evaluate the influence of design parameters on thermal resistance of the module. We found that the thickness of GaAs substrate, the thickness of multi-layer circuit board, the thermal conductivity of bonding material under GaAs substrate, and misalignment of thermal vias between each layer of PCB are the dominant parameter in thermal resistance of the module.
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