ICML

Towards Understanding Gradient Dynamics of the Sliced-Wasserstein Distance via Critical Point Analysis

Christophe Vauthier, Anna Korba, Quentin Mérigot

机构 * Laboratoire de Mathématiques d'Orsay, Université Paris-Saclay, Gif-sur-Yvette, France（巴黎-萨克雷大学奥赛数学实验室） ； Centre de recherche en économie et statistique, ENSAE, Palaiseau, France（经济与统计研究中心） 纠错

Comments 32p

Journal ref Forty-second International Conference on Machine Learning, 2025

No Metric to Rule Them All: Toward Principled Evaluations of Graph-Learning Datasets

Corinna Coupette, Jeremy Wayland, Emily Simons, Bastian Rieck

机构 * University of Fribourg, Switzerland（弗里堡大学） ； Aalto University, Finland（阿尔托大学） ； Max Planck Institute for Informatics, Germany（马克斯·普朗克信息研究所） 纠错

Comments Accepted at ICML 2025

Towards the Use of Saliency Maps for Explaining Low-Quality Electrocardiograms to End Users

Ana Lucic, Sheeraz Ahmad, Amanda Furtado Brinhosa, Vera Liao, Himani Agrawal, Umang Bhatt, Krishnaram Kenthapadi, Alice Xiang, Maarten de Rijke, Nicholas Drabowski

机构 * University of Amsterdam, Netherlands（阿姆斯特丹大学） ； Google, USA（谷歌） ； Microsoft Research, Canada（微软研究院） ； University of Cambridge, United Kingdom（剑桥大学） 纠错

Comments Accepted to ICML 2022 Workshop on Interpretable ML in Healthcare

Action-Constrained Imitation Learning

Chia-Han Yeh, Tse-Sheng Nan, Risto Vuorio, Wei Hung, Hung-Yen Wu, Shao-Hua Sun, Ping-Chun Hsieh

机构 * National Yang Ming Chiao Tung University, Hsinchu, Taiwan（National Yang Ming Chiao Tung University） ； University of Illinois at Urbana-Champaign, Illinois, United States（University of Illinois at Urbana-Champaign） ； National Taiwan University, Taipei, Taiwan（National Taiwan University） 纠错

Comments Published in ICML 2025

SketchDNN: Joint Continuous-Discrete Diffusion for CAD Sketch Generation

Sathvik Chereddy, John Femiani

机构 * Department of Computer Science, Miami-Oxford University, Oxford OH, USA（计算机科学系，迈阿密-牛津大学，牛津 OH，美国） 纠错

Comments 17 pages, 63 figures, Proceedings of the 42nd International Conference on Machine Learning (ICML2025)