COOL: A Cooling-Aware Point Transformer Framework for Thermal Prediction in Advanced 3D/3.5D IC Packaging
COOL:面向先进3D/3.5D IC封装热预测的感知冷却的点Transformer框架
专题命中 点云 :point cloud(abstract)
AI总结 针对先进3D/3.5D IC封装热管理挑战,提出感知冷却的点Transformer框架COOL,显式编码几何与冷却结构,引入PI-BC损失,在自建基准上NMAE达2.4%,速度较商用FEM求解器提升超15.7倍且优于现有学习方法。
Comments 7 pages, accepted at DAC 2026
Journal ref 63rd ACM/IEEE Design Automation Conference (DAC '26), July 2026