发表机构
Université Jean Monnet; Northwestern Polytechnical University（让·莫内大学; 西北工业大学）
机构由 AI 辅助整理，请以论文原文为准。AI 中文总结
本文利用近场增强的零阶贝塞尔-高斯光束实现铝硅酸盐玻璃单步切割，界面粗糙度低于5纳米，归因于赫兹-克努森型蒸发过程，为近原子精度激光加工开辟新路径。
AI 中文摘要
通常，超快激光玻璃切割受爆炸性材料去除机制主导，这限制了可实现的表面粗糙度。本文报道了利用近场增强的零阶贝塞尔-高斯光束，对铝硅酸盐玻璃进行单步切割，残余界面粗糙度低于5纳米，无需后处理即可获得光学质量表面。这种卓越的界面质量无法用传统激光烧蚀机制（如相爆炸、熔体排出或断裂主导的材料去除）解释。相反，对局部热动力学的定量分析表明，材料去除符合赫兹-克努森型蒸发过程，能够实现接近几个分子层精度的逐层去除。这些结果表明，纳米尺度光学约束从根本上改变了透明材料对超快激光照射的响应，并为实现接近原子精度的确定性激光加工开辟了道路。
英文摘要
Generally, ultrafast laser glass dicing is governed by explosive material removal, which restricts the achievable surface roughness. Here we report single-step dicing of aluminosilicate glass with residual interface roughness below 5 nm, producing optical-quality surfaces without post-processing, using near-field-enhanced 0th-order Bessel-Gauss beams. This exceptional interface quality cannot be explained by a conventional laser ablation mechanism, such as phase explosion, melt expulsion, or fracture-dominated material removal. Instead, quantitative analysis of local thermal dynamics indicates that material removal is consistent with a Hertz-Knudsen-type evaporation process, enabling layer-by-layer removal with precision approaching a few molecular layers. These results suggest that nanoscale optical confinement fundamentally alters the response of transparent materials to ultrafast laser irradiation and establish a route toward deterministic laser processing with near-atomic precision.
