发表机构
ETH Zurich（苏黎世联邦理工学院）
机构由 AI 辅助整理，请以论文原文为准。AI 中文总结
本文通过实验验证了无焊接GaN逆变器的可行性，采用螺钉夹紧树脂模具和橡胶压缩垫替代焊接，在热循环和振动测试中无退化，并支持元件更换与复用，但需注塑工艺降低碳足迹。
AI 中文摘要
本文介绍了一种完全无焊接的400 V、2.5 kW氮化镓（GaN）变速驱动（VSD）的设计与实验评估，该驱动采用螺钉夹紧的树脂模具和橡胶压缩垫代替焊接互连。功率级使用650 V GaN功率晶体管，开关频率为200 kHz。将无焊接演示器与使用相同印刷电路板（PCB）的焊接参考实现进行了比较。在散热器温度高达90°C的120多次热循环中，无焊接触点（包括接触电阻）的有效导通电阻没有退化。另外，对无焊接组件进行了从5 Hz到2 kHz的开环振动扫描，加速度幅度超过10 g，使连续供电的演示器保持电气完好；随后的电阻和额定功率检查同样表明没有接触退化。初步生命周期评估（LCA）表明，由于3D打印树脂模具，无焊接实现的隐含碳足迹较高，而前瞻性评估的注塑成型方案将碳足迹降低至接近焊接参考的水平。此外，无焊接组件还实现了非破坏性元件更换，如功率晶体管故障后所演示的那样，以及元件复用。这些结果支持了面向维修、工业相关的千瓦级无焊接功率转换器的可行性。
英文摘要
This paper presents the design and experimental evaluation of a fully solderless realization of a 400 V, 2.5 kW GaN-based variable speed drive (VSD), using screw-clamped resin molds and rubber compression pads instead of soldered interconnections. The power stage uses 650 V GaN power transistors and is operated at a switching frequency of 200 kHz. The solderless demonstrator is compared to a soldered reference realization using an identical printed circuit board (PCB). Over 120 thermal cycles with heatsink temperatures up to 90 °C, the solderless contacts show no degradation in effective on-state resistances (including contact resistances). Separately, open-loop vibration sweeps from 5 Hz to 2 kHz with acceleration amplitudes above 10 g were performed on the solderless assembly and left the continuously powered demonstrator electrically intact; subsequent resistance and nominal-power checks likewise indicate no contact degradation. An initial life-cycle assessment (LCA) indicated a higher embodied carbon footprint for the solderless realization due to 3D-printed resin molds, whereas a prospectively evaluated injection-molding scenario reduces the carbon footprint to near that of the soldered reference. The solderless assembly furthermore enables non-destructive component replacement, as demonstrated after a power transistor failure, as well as component re-use. These results support the feasibility of repair-oriented, industrially relevant kilowatt-class solderless power converters.
CommentsSubmitted to an IEEE journal
