基于热反射的微纳尺度热物理性质测量技术：原理、方法与最新进展
Thermoreflectance-Based Techniques for Micro- and Nanoscale Thermophysical Property Measurements: Principles, Methods, and Recent Advances
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中文总结 AI 辅助
本文综述了基于热反射的微纳尺度热物理性质测量技术，系统比较了TTR、TDTR、FDTR、SSTR、SDTR和SPS方法的原理与适用性，并展望了超高时空分辨率和智能数据处理等新兴方向。
中文摘要 AI 辅助
随着半导体器件向纳米尺度缩小，材料和界面中的热输运及热能存储行为日益依赖于长度尺度、结构和界面。因此，准确表征热物理性质，包括热导率、界面热导和体积热容，对于功能材料设计和先进电子器件的热管理至关重要。光热热反射技术提供非接触式测量，具有高空间和时间分辨率以及广泛的测量范围，使其成为微纳尺度热物理表征的重要工具。本综述考察了瞬态热反射（TTR）、时域热反射（TDTR）、频域热反射（FDTR）、稳态热反射（SSTR）、空间域热反射（SDTR）和方波脉冲源（SPS）方法的物理原理和技术特点。建立了一个统一的热扩散框架，以比较这些方法在参数灵敏度、测量不确定性和适用性方面的差异。代表性应用展示了它们对低热导率材料、各向异性薄膜、晶体材料和多层异质结构的适用性，以及它们在表征薄膜热导率、界面热导和面内/跨平面热输运方面的互补能力。最后，讨论了新兴方向，包括超高时空分辨率、多物理场耦合、在线工业检测、智能数据处理和自然语言驱动分析。
英文摘要
As semiconductor devices shrink toward the nanoscale, heat transport and thermal-energy-storage behavior in materials and interfaces become increasingly dependent on length scale, structure, and interfaces. Accurate characterization of thermophysical properties, including thermal conductivity, interfacial thermal conductance, and volumetric heat capacity, is therefore essential for functional-material design and thermal management of advanced electronic devices. Photothermal thermoreflectance techniques provide noncontact measurements with high spatial and temporal resolution and a broad measurement range, making them important tools for micro- and nanoscale thermophysical characterization. This review examines the physical principles and technical characteristics of transient thermoreflectance (TTR), time-domain thermoreflectance (TDTR), frequency-domain thermoreflectance (FDTR), steady-state thermoreflectance (SSTR), spatial-domain thermoreflectance (SDTR), and the square-pulsed source (SPS) method. A unified heat-diffusion framework is established to compare these methods in terms of parameter sensitivity, measurement uncertainty, and applicability. Representative applications illustrate their suitability for low-thermal-conductivity materials, anisotropic films, crystalline materials, and multilayer heterostructures, as well as their complementary capabilities for characterizing thin-film thermal conductivity, interfacial thermal conductance, and in-plane/cross-plane heat transport. Finally, emerging directions are discussed, including ultrahigh spatiotemporal resolution, multiphysics coupling, in-line industrial inspection, intelligent data processing, and natural-language-driven analysis.
发表机构
- Huazhong University of Science and Technology（华中科技大学）
- Renmin University of China（中国人民大学）
- Peking University（北京大学）
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