发表机构
University of Minnesota（明尼苏达大学）
机构由 AI 辅助整理，请以论文原文为准。AI 中文总结
本文针对先进3D异构集成系统的高功率密度与引脚瓶颈，提出多级分布式功率传输设计方法，以在性能、热和可靠性约束下实现可靠的多千瓦级供电。
AI 中文摘要
现代应用的需求要求构建日益复杂的集成系统，其中人工智能应用尤其成为推动系统规模增长的重要驱动力，系统规模可能突破万亿晶体管大关。构建这些系统的路径需要采用先进封装技术，将异构集成的2D和3D小芯片放置在基板之上。此类计算能力强大的系统需要大量功率进行计算：在高功率密度和引脚数量瓶颈的背景下，可靠且稳健的功率传输是一项重大挑战。本文概述了通过设计多级分布式功率传输系统来构建克服此问题的设计方法，这些系统针对性能和可靠性进行了优化，并设计为在严格的性能、热和可靠性约束下共存。
英文摘要
The demands of modern applications require the construction of ever more complex integrated systems, with AI applications in particular serving as a significant driver for increased system size, potentially going beyond the trilliontransistor mark. The path to building these systems requires the use of advanced packaging, with heterogeneous integrated 2D and 3D chiplets placed atop a substrate. Such computationally powerful systems require significant power for computation: reliable and robust power delivery is a major challenge in light of high power densities and pin count bottlenecks. This paper overviews approaches to building design methodologies that overcome this problem, through the design of multistage distributed power delivery systems, optimized for performance and reliability, and built to coexist within stringent performance, thermal, and reliability constraints.
