发表机构
Google Quantum AI; Purdue Quantum Science and Engineering Institute, Purdue University; Department of Physics, University of California, Santa Barbara（谷歌量子人工智能; 普渡大学量子科学与工程研究所; 加州大学圣塔芭芭拉分校物理系）
机构由 AI 辅助整理，请以论文原文为准。AI 中文总结
本文针对大型超导量子处理器中电磁耦合提取的多尺度难题，提出四种基于不同物理原理的数值方法，并在10×10 transmon阵列上验证，结果一致且差异小于5%。
AI 中文摘要
超导量子处理器的高保真控制需要精确表征器件各组成元件之间的电磁耦合强度。在目前包含数百个量子比特的大规模架构中，精确提取这些耦合构成一个具有挑战性的多尺度建模问题。这需要解析从约瑟夫森结及其引线的纳米尺度几何到封装金属盒的厘米尺度尺寸等多个尺度。我们提出了四种数值耦合提取方法，分别基于避免能级交叉、能量参与比、感应电动势和阻抗矩阵。这些方法适用于商用三维电磁求解器。我们在一个$10\ imes10$的transmon量子比特阵列上对这些技术进行了基准测试，提取了它们与封装盒驻波模式的耦合。我们的结果表明，这些方法产生的耦合强度一致，最大相对差异小于5%。
英文摘要
High-fidelity control of superconducting quantum processors requires accurate characterization of electromagnetic coupling strengths among the device's constituent elements. Accurately extracting these couplings across large-scale architectures, presently featuring hundreds of qubits, poses a challenging multi-scale modeling problem. This requires resolving scales from the nanometer-scale geometry of Josephson junctions and their leads to the centimeter-scale size of the enclosing metallic packages. We present four numerical coupling extraction methods based on the avoided level crossing, the energy participation ratio, the induced electromotive force, and the impedance matrix. These methods are tailored to work with commercially available 3D electromagnetic solvers. We benchmark these techniques on a $10\times10$ array of transmon qubits, extracting their couplings to standing package modes. Our results show that these methods yield consistent coupling strengths with a maximum relative difference of less than 5%.
Comments17 pages, 11 figures
