发表机构
Fraunhofer Institute for Photonic Microsystems IPMS; Institute of Applied Physics, TU Dresden; Keio University; ctd.qmat: Dresden-Würzburg Cluster of Excellence—EXC 2147, TU Dresden（弗劳恩霍夫光子微系统研究所; 德累斯顿工业大学应用物理研究所; 庆应义塾大学; 德累斯顿-维尔茨堡卓越集群 ctd.qmat（TU德累斯顿））
机构由 AI 辅助整理，请以论文原文为准。AI 中文总结
该研究通过数值模拟液氮微柱芯蒸发冷却，发现其局部热性能优异（温升约2.7K），但横向扩展受毛细干涸限制，并提出标度关系指导设计。
AI 中文摘要
低温计算技术正在迅速成熟，但在提高器件密度和工作功率时，散热仍然是一个关键挑战。两相蒸发冷却是一种有前景的解决方案，因为它能在保持较小温升的同时耗散高热通量。在此，我们数值研究了填充液氮的硅微柱芯作为低温电子器件的毛细供液薄膜蒸发概念。该模型结合了Young-Laplace弯月面计算、Hertz-Knudsen-Schrage蒸发、单元胞传热和液体流动模拟，以及阵列级热和毛细流动模型。对于具有代表性几何结构（柱径为10微米、间距为24微米、柱高为75微米，施加热通量为20瓦每平方厘米）的情况，预测的芯片温升约为2.7开尔文。这远低于通过铟夹层铜散热器进行代表性传导冷却和直接液氮浸没冷却的估计温升。相应的预测单侧供液干涸长度约为2.7毫米，相当于理想双侧供液可冷却宽度约为5.3毫米。结果表明，局部热性能良好，而横向可扩展性主要受毛细干涸限制。一个近似的毛细-黏性标度关系提供了一个紧凑的框架，用于比较不同工作流体和相关芯几何结构之间的干涸极限，并确定扩展毛细供液传输的策略。
英文摘要
Cryogenic computing technologies are maturing rapidly, but heat removal remains a key challenge when increasing the device density and operating power. Two-phase evaporative cooling is a promising approach to solve this issue, because it can dissipate high heat fluxes while maintaining small temperature rises. Here, we numerically investigate liquid-$\mathrm{N_2}$-filled silicon micropillar wicks as a capillary-fed thin-film evaporation concept for cryogenic electronics. The model combines Young-Laplace meniscus calculations, Hertz-Knudsen-Schrage evaporation, unit-cell heat-transfer and liquid-flow simulations, and an array-level thermal and capillary-flow model. For a representative geometry with a pillar diameter of $10\,μ\mathrm{m}$, pitch of $24\,μ\mathrm{m}$, and pillar height of $75\,μ\mathrm{m}$ at an applied heat flux of $20\,\mathrm{W\,cm^{-2}}$, the predicted chip-temperature rise is approximately $2.7\,\mathrm{K}$. This is substantially below the estimated temperature rises for representative conduction cooling through an indium-interlayered copper heat sink and direct liquid-$\mathrm{N_2}$ immersion. The corresponding predicted single-fed dry-out length is approximately $2.7\,\mathrm{mm}$, equivalent to an ideal double-fed coolable width of approximately $5.3\,\mathrm{mm}$. The results indicate that local thermal performance is favorable, whereas lateral scalability is primarily constrained by capillary dry-out. An approximate capillary-viscous scaling relation provides a compact framework for comparing dry-out limits across working fluids and related wick geometries and for identifying strategies to extend capillary-fed transport.
Comments24 pages, 9 figures, 1 table
