发表机构
University of Udine; TU Wien; Politecnico di Torino（乌迪内大学; 维也纳科技大学; 都灵理工大学）
机构由 AI 辅助整理，请以论文原文为准。AI 中文总结
本文全面概述沸腾流界面解析模拟的最新进展，分析其优势局限与开放挑战，指出该类模拟精度依赖亚格子闭合与流体力学求解器的保真度。
AI 中文摘要
沸腾传热是许多需要散出大热流密度应用的基础，其特征是存在大量耦合的多尺度输运现象，因此对其进行精确数值预测是长期存在的挑战。在此背景下，界面解析模拟方法（明确或隐式描述液-气界面）取得了显著进展，这得益于数值格式的改进、更完整的热力学与可压缩性建模，以及计算资源的日益充足。本文全面概述了沸腾流界面解析模拟的最新进展，研究了控制流动和温度场的不同格式、界面处热量与质量传递的耦合策略，以及核化、微层蒸发、接触线动力学等小尺度物理过程的现有建模方法。通过分析近期高保真模拟的结果，核心发现是沸腾的界面解析模拟在流体力学上是解析的，但在微观层面是建模的：其预测精度对核化、微层和接触线物理的亚格子闭合的依赖程度，不亚于对流体力学求解器保真度的依赖程度。在此基础上，本文讨论了现有方法的优势与局限，以及精确描述沸腾传热方面的开放挑战。
英文摘要
Boiling heat transfer underpins many applications where large heat fluxes must be dissipated. Boiling is characterized by a wide range of coupled multiscale transport phenomena, making its accurate numerical prediction a long-standing challenge. In this context, interface-resolved simulation approaches - where the liquid-vapor interface is either explicitly or implicitly described - have undergone significant advancements, driven by improved numerical formulations, more complete thermodynamic and compressibility modeling, and the growing availability of computational resources. Here, we provide a comprehensive overview of the state of the art in interface-resolved simulations of boiling flows. We examine the different formulations governing the flow and temperature field, strategies for coupling heat and mass transfer at the interface, and current modeling approaches for small-scale physics such as nucleation, microlayer evaporation, and contact-line dynamics. By analyzing insights from recent high-fidelity simulations, a central observation is that interface-resolved simulations of boiling are hydrodynamically resolved but microscopically modeled: their predictive accuracy depends on the sub-grid closures for nucleation, microlayer, and contact-line physics no less than on the fidelity of the hydrodynamic solver. We discuss the strengths and limitations of available methods on this basis, together with the open challenges in the accurate description of boiling heat transfer.
