集成微波光子学：从材料平台到片上系统
Integrated Microwave Photonics: From Material Platforms to Systems-on-Chip
- Jinan University（暨南大学）
- University of Ottawa（渥太华大学）
机构由 AI 辅助整理，请以论文原文为准。
AI总结：
本文综述集成微波光子学（IMWP）的最新进展，梳理不同材料平台的特性，介绍从孤立器件到多类片上系统的发展，探讨该领域未来需解决的核心问题。
AI中文摘要：
本文综述了集成微波光子学（IMWP）的最新进展，涵盖材料平台、集成技术及系统功能，并探讨了新兴机遇与未来展望。硅（Si）和氮化硅（SiN）可提供高密度路由、可编程滤波及低损耗延迟；磷化铟（InP）具备光增益、光产生及高速光电探测能力；薄膜铌酸锂（TFLN）则提供线性宽带电光转换；光子集成正成为协同互补功能的可行路径。近期研究已从孤立的调制器、滤波器和延迟线显著转向芯片级与模块级系统，涵盖信号处理引擎、实时频谱感知、全频谱无线链路、光纤-无线转换、硅波束成形、集成雷达、可编程处理器及带有片上光源与探测器的光子卷积引擎。随着这些演示日趋成熟完善，关键问题已从带宽与效率转向系统集成、微波封装、校准稳定性、模拟链路性能及应用级验证。
英文摘要：
In this paper, recent advances in integrated microwave photonics (IMWP) are reviewed, including material platforms, integration technologies, and system functionalities. Emerging opportunities and future perspectives are discussed. Silicon (Si) and silicon nitride (SiN) provide dense routing, programmable filtering, and low-loss delay; indium phosphide (InP) supplies optical gain, light generation, and high-speed photodetection; thin-film lithium niobate (TFLN) offers linear and broadband electro-optic conversion; and photonic integration is emerging as a practical path to synergize complementary capabilities. Recent work shows a marked shift from isolated modulators, filters, and delay lines toward chip- and module-level systems, ranging from signal processing engines, real-time spectrum sensing, to full-spectrum wireless links, fiber-wireless conversion, silicon beamforming, integrated radar, programmable processors, and photonic convolution engines with on-chip sources and detectors. As these demonstrations become more mature and complete, the key questions move beyond bandwidth and efficiency toward system integration, microwave packaging, calibration stability, analog link performance, and application-level validation.
