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arXiv 2608.22831cond-mat.mes-hall

二维拓扑绝缘体中的 antidot 超晶格

Antidot superlattices in two-dimensional topological insulators

Haolin Huang, Jackson S. Smith, Fabio Taddei, Michele Governale, Jared H. Cole

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中文总结 AI 辅助

该研究通过Bernevig-Hughes-Zhang模型等方法,探究了图案化圆形孔洞阵列的二维拓扑绝缘体的电子与拓扑性质,发现孔洞靠近时其拓扑特性会消失,且图案化可兼容现有光刻技术,具备未来电子应用潜力。

中文摘要 AI 辅助

我们研究了图案化有圆形孔洞阵列的二维拓扑绝缘体的电子性质。采用Bernevig-Hughes-Zhang模型计算拓扑绝缘体超晶格的能带结构,并用有限元法进行离散化处理。利用Fukui-Hatsugai-Suzuki方法研究能带拓扑,该方法利用了能带隙闭合再打开时拓扑电荷守恒的特性。我们发现,当孔洞彼此靠近且边缘态显著重叠时,该材料会失去拓扑特性,成为平庸绝缘体。结果表明,对拓扑绝缘体进行图案化会改变其性质,且该过程可采用与当前光刻技术兼容的特征尺寸实现,这显示出将图案化拓扑绝缘体应用于未来电子学的潜力。

英文摘要

We investigate the electronic properties of a two-dimensional topological insulator patterned with an array of circular holes. The band structures of the topological insulator superlattices are calculated using the Bernevig-Hughes-Zhang model, discretized with the finite element method. The band topology is studied using the Fukui-Hatsugai-Suzuki method, exploiting the fact that topological charge is conserved when a band gap closes and reopens. We find that when the holes are close to each other and the edge states overlap significantly, the material loses its topological character and becomes a trivial insulator. The results show that patterning topological insulators changes their properties, and this can be achieved with a feature size compatible with current lithographic techniques. This shows the potential to incorporate patterned topological insulators in future electronics.

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