用于大规模亚毫米波和毫米波焦平面的激光微加工硅片馈源喇叭
Laser-micromachined silicon-platelet feedhorns for large-scale submillimeter and millimeter-wave focal planes
浏览论文内容
中文总结 AI 辅助
该研究研发了激光微加工制备的硅片馈源喇叭阵列，可用于毫米波及亚毫米波波段，其性能与传统DRIE制备的馈源相当，有望降低大规模生产的成本与人力，将应用于Prime-Cam的CCAT 350GHz模块。
中文摘要 AI 辅助
我们展示了采用激光微加工制备的首批硅片馈源喇叭阵列的制备工艺与特性表征。首先，我们在80GHz至170GHz的毫米波波段对该技术进行了演示，该波段覆盖了宇宙微波背景（CMB）实验典型的90/150GHz波段。接着，我们将该技术扩展到150mm晶圆上的大规模生产，并验证其在亚毫米波波长下的工作性能。该馈源喇叭阵列被优化为以350GHz（330GHz至370GHz）为中心的波段工作，目前正作为Prime-Cam的CCAT 350GHz模块的焦平面元件之一投入使用。我们介绍了这些馈源喇叭阵列的设计与制备工艺，并将其光学性能与模拟结果、以及采用传统深反应离子刻蚀（DRIE）制备的相同设计的馈源喇叭进行了直接对比。最后，我们讨论了该技术未来的扩展方向，包括侧壁控制的潜力，以及使用更厚（因此数量更少）的晶圆，这有望显著降低生产成本和人力投入。
英文摘要
We present the fabrication and characterization of the first silicon-platelet feedhorn arrays produced using laser micromachining. First, we present a demonstration of the technology for the millimeter-wave band of 80~GHz to 170~GHz, i.e. covering the 90/150~GHz bands typical of CMB experiments. Next, we expand the technology to large-scale production on 150~mm wafers and demonstrate operation at submillimeter wavelengths. This feedhorn array is optimized for operation in a band centered at 350~GHz (330~GHz to 370~GHz) and is being deployed as one of the focal plane elements of the CCAT 350~GHz module of Prime-Cam. We present the design and fabrication processes for these feedhorn arrays and compare the optical performance directly to simulation and to feedhorns of identical design but produced using traditional deep reactive-ion etching (DRIE). We conclude with a discussion of future expansions of this technology, including the potential of sidewall control and using thicker (and thus fewer) wafers, which could significantly reduce production costs and labor.
