硅光子芯片间的实验量子远程克隆
Experimental quantum telecloning across silicon photonic chips
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中文总结 AI 辅助
研究人员利用硅光子平台，通过光纤连接的两个光子芯片实现1对2对称量子远程克隆，片间克隆保真度78.45±1.39%，为大规模量子网络奠定基础。
中文摘要 AI 辅助
量子远程克隆是量子隐形传态与量子克隆的结合，为将未知量子态以最优保真度分发至多个空间分离的接收方提供了强大机制，尽管其对量子网络具有概念上的重要性，但对称量子比特量子远程克隆的实验演示仍难以实现，尤其由于生成多体纠缠资源态以及在分布式节点间实现稳定多光子干涉存在挑战。在此，我们利用可扩展的硅光子平台实现了最优1对2对称量子远程克隆。我们采用两个通过光纤连接的独立光子芯片执行六光子协议：一个芯片产生预告式输入态，另一个芯片制备四光子纠缠资源态。通过执行片间贝尔态测量，我们成功将输入态分发至远程节点处的两个最优克隆体。我们观测到片间克隆保真度为78.45±1.39%，超出经典极限2/3达8个标准差。我们的结果证明了集成芯片间复杂多光子态的稳健生成与操控，为大规模多方量子网络提供了基础构建模块。
英文摘要
Telecloning -- the combination of quantum teleportation and cloning -- offers a powerful mechanism to disseminate unknown quantum states to multiple spatially separated recipients with optimal fidelity. Despite its conceptual importance for quantum networks, an experimental demonstration of symmetric qubit quantum telecloning remains elusive, particularly due to the challenges of generating multipartite entangled resource states and implementing stable multi-photon interference across distributed nodes. Here, we realize the optimal 1 to 2 symmetric quantum telecloning using a scalable silicon photonic platform. We implement a six-photon protocol using two independent, fiber-linked photonic chips: one generating a heralded input state and the other preparing a four-photon entangled resource state. By performing an interchip Bell-state measurement, we successfully distribute the input state into two optimal clones at remote nodes. We observe an interchip cloning fidelity of 78.45 $\pm$ 1.39%, exceeding the classical limit of 2/3 by 8 standard deviations. Our results demonstrate the robust generation and manipulation of complex multi-photon states between integrated chips, providing a foundational building block for large-scale multi-party quantum networks.
