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arXiv 2608.11651physics.app-phcs.SYeess.SY

面向多智能体通信与空间感知的频域太赫兹收发芯片

A Frequency-Space Terahertz Transceiver Chip for Multi-Agent Communications and Spatial Awareness

Xiaoyue Xia, Zhicheng Lin, Hao Guo, Siran Wang, Jingyuan Zhang, Xinyu Fang, Ka Fai Chan, Shum Kam Man, Geng-Bo Wu, Chi Hou Chan

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中文总结 AI 辅助

该研究开发了一款208-258GHz的65nm CMOS太赫兹收发芯片,通过异质漏波超表面实现频率控制波束扫描,支持多智能体通信与空间感知,为太赫兹具身智能网络提供可扩展硬件平台。

中文摘要 AI 辅助

未来室内具身智能系统需要可扩展的硬件平台,同时支持高容量多智能体连接与相互空间感知。太赫兹(THz)频谱具备丰富带宽与固有空间选择性,适用于集成传感与通信(ISAC);但常规相控阵与可编程超表面依赖密集波束成形网络、单元级控制或外部太赫兹照明,难以实现可扩展多波束操作。本文报道一款完全集成的208-258GHz 65nm CMOS太赫兹收发芯片,在1.5mm×4.9mm面积内单片集成宽带前端与异质漏波超表面(HLM)孔径。HLM产生强色散漏模,仅用4个超原子即可实现75度频率控制波束扫描。频域与空域混频的协同设计为空间频分多址(SFDMA)通信实现了频谱纯净的频空映射。该太赫兹芯片演示了多智能体同时收发、二维定位及传感增强通信,为未来太赫兹具身智能网络提供可扩展硬件平台。

英文摘要

Future indoor embodied-intelligence systems require scalable hardware platforms that support both high-capacity multi-agent connectivity and mutual spatial awareness. The terahertz (THz) spectrum offers abundant bandwidth and inherent spatial selectivity for integrated sensing and communication (ISAC); however, conventional phased arrays and programmable metasurfaces rely on dense beamforming networks, element-level control, or external THz illumination, making scalable multibeam operation challenging. Here, we report a fully integrated 208-258GHz 65-nm CMOS THz transceiver chip that monolithically integrates broadband front ends with heterogeneous leaky-wave metasurface (HLM) apertures within a 1.5mm by 4.9mm area. The HLM generates strongly dispersive leaky modes, enabling 75 degree frequency-controlled beam scanning with only four meta-atoms. Co-design of frequency-domain and spatial-domain mixing achieves spectrally clean frequency-to-space mapping for spatial-frequency division multiple access (SFDMA) communication. The THz chip demonstrates multi-agent simultaneous transmission and reception, two-dimensional localization, and sensing-enhanced communication, providing a scalable hardware platform for future THz embodied-intelligence networks.

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