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压力下的破裂——研究低温下ATLAS条形探测器花瓣上硅裂缝的缓解方法

Cracking under pressure --- investigating mitigation approaches for silicon fractures on ATLAS strip tracker petals at cold temperatures

S. H. Abidi, J. -H. Arling, M. J. Basso, S. Beaupre, I. Bloch, A. J. Blue, M. Caspar, J. Chen, S. Díez Cornell, U. Epstein, E. K. Filmer, A. Fournier, L. Franconi, A. Gabrielli, J. A. Hallford, S. Heim, C. M. Helling, N. P. Hessey, R. M. Jacobs, T. Kuhl, M. Licht, C. K. Mahajan, S. Manson, K. Mauer, S. Oerdek, V. Platero Montagut, L. Poley, C. O. Sander, K. Ran, S. Sinha, C. Solaz Contell, U. Soldevila Serrano, D. Sperlich, B. Stelzer, A. H. Tigchelaar, E. Torres Reoyo, G. Vallone, L. M. Veloce

arXiv 2607.25080首次发表:更新:

AI 中文总结

针对大型强子对撞机高亮度升级中ATLAS实验全硅内跟踪器低温下硅传感器开裂问题,本文基于粘合剂选择及沉积模式修改提出缓解策略,能有效防止低温下开裂,减少冷却系统故障时的裂缝比例。

AI 中文摘要

对于大型强子对撞机的高亮度升级,ATLAS实验将用全硅内跟踪器(ITk)取代当前的内探测器,其条形探测器由桶部和端盖组成。ITk通常在-35°C用液态CO₂冷却,但冷却系统故障时传感器温度可能低于-35°C,此时硅传感器会物理性开裂。本文介绍了针对花瓣的缓解策略,基于对模块组装和花瓣加载中粘合剂选择及其沉积模式的修改。最有前景的策略可防止在冷却系统问题时低至-45°C的温度下开裂,在灾难性冷却系统故障时低至-55°C循环后仅有小比例裂缝。

英文摘要

For the High-Luminosity upgrade of the Large Hadron Collider, the ATLAS experiment will replace its current Inner Detector with an all-silicon Inner Tracker (ITk), consisting of pixel and strip detectors. The strip detector will consist of a central region or "barrel" assembled with staves and forward regions or "end-caps" assembled with petals. The ITk will nominally operate with liquid $\textrm{CO}^2$ cooling at $-35\,^\circ\textrm{C}$; however, in the event of cooling system failures, it is possible that sensors will experience temperatures below $-35\,^\circ\textrm{C}$. At these low temperatures, it has been observed that the silicon sensors within modules --- the fundamental readout units of the detector --- can physically crack, rendering the modules inoperable. Understanding and resolving the issue of sensor cracking was one of the most important and urgent issues for the ITk project. This paper presents part of the mitigation strategies developed for petals. These mitigation strategies are based on modifications to the choice of adhesive and its deposition pattern for module assembly and petal loading. The most promising mitigation strategy presented here prevents cracking to temperatures as low as $-45\,^\circ\textrm{C}$, which can be expected in case of cooling system problems, with a small percentage of cracks observed after being cycled to $-55\,^\circ\textrm{C}$, which can be expected in case of catastrophic cooling system failures.

Comments39 pages; published in JINST

Journal refJINST 21 P07026 (2026)

DOI:10.1088/1748-0221/21/07/P07026

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