AI 中文总结
该研究针对传统太赫兹3D成像的局限，提出将3D打印非局部自由形式贝塞尔光束透镜与高功率CMOS振荡器辐射器阵列集成的平台，利用非局部相互作用生成特定光束，克服旁瓣限制，实现高保真2D及3D成像，建立了通用经济的下一代集成太赫兹光子学范式。
AI 中文摘要
高性能太赫兹（THz）3D成像对无损评估至关重要。传统架构受色差严重、空间分辨率适中、焦深有限和商业收发器体积庞大等限制。超表面虽提供紧凑替代方案，但实现宽带消色差超分辨率和扩展焦深仍具挑战。本文提出高度集成的3D THz成像平台，将3D打印的非局部自由形式贝塞尔光束透镜与高功率65nm CMOS振荡器辐射器阵列协同。利用透镜内非局部相互作用，生成消色差超分辨率贝塞尔光束（0.3至1 THz），半高宽为0.65λ且焦深为4.7mm。该系统克服传统旁瓣限制，能对复杂亚毫米目标进行高保真2D成像，还能通过高散射介质进行稳健3D体积成像。通过融合标准CMOS技术和增材制造，为下一代集成THz光子学建立了通用、经济高效的范例。
英文摘要
High performance terahertz (THz) 3D imaging is critical for non-destructive evaluation. However, conventional architectures are fundamentally limited by severe chromatic aberrations, modest spatial resolution, restricted depths of focus (DOF), and the bulky nature of commercial transceivers. While metasurfaces offer a compact alternative, achieving broadband achromatic super-resolution with an extended DOF remains a formidable challenge. Here, we present a highly integrated 3D THz imaging platform that synergizes a 3D printed nonlocal freeform Bessel-beam lens with a high power, 65nm CMOS oscillator radiator array. Harnessing nonlocal interactions within the lens, we generate an achromatic super resolution Bessel beam (0.3 to 1 THz) with a subdiffraction full width at half maximum (FWHM) of 0.65λ and a robust 4.7-mm DOF. Crucially, the system overcomes conventional sidelobe limitations, enabling high-fidelity 2D imaging of intricate sub-millimeter targets (e.g., USAF 1951 charts and QR codes) alongside robust 3D volumetric imaging through highly scattering media, such as printed circuit boards. By converging standard CMOS technology with additive manufacturing, this work establishes a versatile, cost-effective paradigm for next-generation integrated THz photonics
Comments18 pages, 6 figures in the main text, 11 pages, 13 figures in the Supplementary files
