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超分辨率是否保留缺陷证据?半导体检测的低误报基准

Does Super-Resolution Preserve Defect Evidence? A Low-False-Call Benchmark for Semiconductor Inspection

Shaoliang Yang, Jun Wang

arXiv 2607.17401首次发表:更新:

发表机构

Santa Clara University(圣克拉拉大学)

机构由 AI 辅助整理,请以论文原文为准。

AI 中文总结

研究超分辨率在半导体检测中是否保留缺陷证据,通过特定基准实验,将重建与检测分离并以低误报率评估,发现重建保真度与检测效用有差异,得出检测超分辨率应依任务证据和操作点转移判断而非仅看重建质量的结论。

AI 中文摘要

超分辨率可能使检测图像看起来更清晰,但不保留检测缺陷所需的证据。我们通过一个基准来研究这种失败模式,该基准将重建与检测分开,并以预先声明的低误报率进行评估。十个端到端重复实验将独立生成的线/间距和接触孔图像与模型训练、校准、清洁对照、弱缺陷和保留的缺陷形态相结合。每个重建由相同的局部残差检测器评分,而直接和联合训练的检测器形成单独的比较轨迹。重建保真度和检测效用存在差异:两个学习到的重建模型在结构相似性上达到最高,但在每对重复实验中检测到的缺陷像素比双三次插值少。直接的DeepLabV3检测器在误报率为0.000174±0.000084时召回率达到0.1984±0.0385,并在所有十次重复实验中满足保留的可行性标准。一个示例联合模型DPU-WaferSR通过了独立的清洁校准,但在所有十次重复实验中超过了保留的极限,表明校准成功并不保证转移。对于每种可行方法,弱缺陷召回率仍接近零。将不变的策略应用于4591个公共卡林西亚-S掩模,进一步揭示了在真实SEM纹理上方法依赖的大偏移。这些结果支持一个简单的结论:用于检测的超分辨率应该通过保留的任务证据和操作点转移来判断,而不仅仅是重建质量。

英文摘要

Super-resolution can make inspection images appear sharper without preserving the evidence needed to detect a defect. We study this failure mode with a benchmark that separates reconstruction from detection and evaluates both at a predeclared low false-positive rate. Ten end-to-end repetitions combine independently generated line/space and contact-hole images with model training, calibration, clean controls, weak defects, and a held-out defect morphology. Every reconstruction is scored by the same local residual detector, while direct and jointly trained detectors form a separate comparison track. Reconstruction fidelity and inspection utility diverge: the two learned reconstruction models attain the highest structural similarity yet detect fewer defect pixels than bicubic interpolation in every paired repetition. A direct DeepLabV3 detector reaches $0.1984\pm0.0385$ recall at $0.000174\pm0.000084$ false-positive rate and satisfies the held-out feasibility criterion in all ten repetitions. An illustrative joint model, DPU-WaferSR, passes independent clean calibration but exceeds the held-out limit in all ten repetitions, demonstrating that calibration success does not guarantee transfer. Weak-defect recall remains near zero for every feasible method. Applying the unchanged policies to 4,591 public Carinthia-S masks further reveals large method-dependent shifts on real SEM texture. These results support a simple conclusion: super-resolution for inspection should be judged by preserved task evidence and operating-point transfer, not reconstruction quality alone.

Comments27 pages, 12 figures

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