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arXiv 2606.08045physics.opticsphysics.atom-phphysics.plasm-ph
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通过同步双束2微米激光照射实现极紫外转换效率提升40%

40% boost in extreme ultraviolet conversion efficiency via simultaneous dual-beam 2-μm laser irradiation

Utsunomiya University(宇都宫大学);RIKEN Center for Advanced Photonics, RIKEN(理化学研究所先进光子学研究中心);The University of Tokyo(东京大学);Tohoku University(东北大学);University College Dublin(都柏林大学学院);Hiroshima University(广岛大学)
Naoki Nagahama, Kaito Nishimiya, Shunya Yamamoto, Hayato Yazawa, Yuta Takai, Chisato Tanaka, Kazuyuki Sakaue, Atsushi Sunahara, Gerry O'Sullivan, Shinichi Namba… 展开作者

Naoki Nagahama, Kaito Nishimiya, Shunya Yamamoto, Hayato Yazawa, Yuta Takai, Chisato Tanaka, Kazuyuki Sakaue, Atsushi Sunahara, Gerry O'Sullivan, Shinichi Namba, Takeshi Higashiguchi, Eiji J. Takahashi

AI总结:

采用2090 nm Ho:YAG激光同步双束照射平面Sn靶,在相同总能量下将EUV转换效率从2.6%提升至3.6%,创下2微米驱动激光等离子体源的最高纪录,且等离子体条件基本不变。

摘要:

为下一代光刻技术提升极紫外(EUV)光源功率,需要在降低单脉冲能量的同时提高转换效率(CE)。我们通过使用2090 nm、20 ns的Ho:YAG激光同步双束照射平面Sn靶,实现了40%的CE增强。单束40 mJ照射的EUV CE为2.6%;将相同总能量等分为两束各20 mJ(峰值强度相同)后,EUV CE提升至3.6%,这是2微米驱动激光等离子体源中报道的最高值。两种配置下的EUV源尺寸(60-70 μm)和离子能谱几乎相同,证实了等离子体条件相当。由于该方案仅需被动分束,且易于扩展至三束或更多,它为高数值孔径和超数值孔径光刻提供了实现多千瓦级、节能型EUV源的实用途径。

英文摘要:

Scaling extreme ultraviolet (EUV) source power for next-generation lithography demands higher conversion efficiency (CE) at reduced per-pulse energies. We demonstrated a 40% CE enhancement by simultaneous dual-beam irradiation of a planar Sn target with a 2090-nm, 20-ns Ho:YAG laser. Single-beam irradiation at 40 mJ yielded an EUV CE of 2.6%; splitting the same total energy equally into two beams of 20 mJ each - at identical peak intensity - raised the EUV CE to 3.6%, which was the highest reported for 2-μm-driven laser-produced plasma sources. The EUV source size (60-70 μm) and energetic-ion spectra were nearly identical across both configurations, confirming comparable plasma conditions. Because the scheme requires only passive beam splitting and scales readily to three or more beams, it offers a practical route toward multi-kW-class, energy-efficient EUV sources for high-NA and hyper-NA lithography.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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