InterPUF：通过物理不可克隆函数和多方计算实现的分布式认证用于可重构互插件
InterPUF: Distributed Authentication via Physically Unclonable Functions and Multi-party Computation for Reconfigurable Interposers
AI总结：
InterPUF通过物理不可克隆函数和多方计算实现分布式认证，为可重构互插件提供安全且高效的认证方案。
摘要：
现代系统封装（SiP）平台越来越多地采用可重构互插件，以在异构多供应商生态系统中实现即插即用的芯片片集成。然而，这种灵活性带来了严重的信任挑战，因为传统认证方案在去中心化、后制造可编程环境中无法扩展或适应。本文提出了InterPUF，一种紧凑且可扩展的认证框架，将互插件转变为分布式根信任。InterPUF在可重构互连中嵌入基于路由的差分延迟物理不可克隆函数（PUF），并通过多方计算（MPC）进行认证，确保原始PUF签名 never 被暴露。我们的硬件评估显示，在各种芯片片上仅产生0.23%的面积和0.072%的功耗开销，同时保持认证延迟在数十纳秒内。使用pyPUF进行的模拟结果证实了在工艺、电压和温度变化下具有强唯一性、可靠性和建模抗性。通过结合互插件驻留的PUF原语与加密哈希和协作验证，InterPUF强制执行最小信任认证模型，而无需依赖集中式锚点。
英文摘要：
Modern system-in-package (SiP) platforms increasingly adopt reconfigurable interposers to enable plug-and-play chiplet integration across heterogeneous multi-vendor ecosystems. However, this flexibility introduces severe trust challenges, as traditional authentication schemes fail to scale or adapt in decentralized, post-fabrication programmable environments. This paper presents InterPUF, a compact and scalable authentication framework that transforms the interposer into a distributed root of trust. InterPUF embeds a route-based differential delay physically unclonable function (PUF) across the reconfigurable interconnect and secures authentication using multi-party computation (MPC), ensuring raw PUF signatures are never exposed. Our hardware evaluation shows only 0.23% area and 0.072% power overhead across diverse chiplets while preserving authentication latency within tens of nanoseconds. Simulation results using pyPUF confirm strong uniqueness, reliability, and modeling resistance under process, voltage, and temperature variations. By combining interposer-resident PUF primitives with cryptographic hashing and collaborative verification, InterPUF enforces a minimal-trust authentication model without relying on a centralized anchor.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
