纳米晶薄膜的加速再结晶作为扩散系数内部尺寸效应的体现
Accelerated recrystallization of nanocrystalline films as a manifestation of the inner size effect of the diffusion coefficient
AI总结：
本文研究了100 nm厚铜银多晶薄膜的再结晶行为，发现退火后晶粒尺寸分布的演变及异常高的晶界扩散系数，证实了薄膜中自扩散过程的显著强化现象。
摘要：
本文致力于研究100 nm厚的铜和银多晶薄膜的再结晶。研究发现，通过热蒸发法在室温下沉积到基底上的铜薄膜中，观察到双峰晶粒尺寸分布，其极大值分别位于15和35 nm处。铜薄膜中的双峰分布在退火过程中得以保持，这导致晶粒尺寸分布直方图的两个峰均向较大尺寸区域移动。与Cu不同，沉积态Ag薄膜中除了纳米级部分外，甚至存在微米级晶粒。这些晶粒由于自退火现象而形成，并且由于晶粒生长停滞在加热过程中演变微弱。沉积态Ag薄膜中的纳米级部分由最可几尺寸为25 nm的晶粒组成，在250°C温度下经过短时间退火后，该尺寸增加到50 nm。测定了晶界扩散系数，对于两种金属薄膜均大于10-18 m2/s。所得数值表明薄膜中自扩散过程发生了多重强化，其厚度允许我们将它们归类为宏观样品。
英文摘要：
This paper is devoted to studying the recrystallization of 100 nm thick polycrystalline films of copper and silver. It is found that in copper films deposited by the thermal evaporation method onto a substrate at room temperature, a bimodal crystallite size distribution with maxima at 15 and 35 nm is observed. The bimodal distribution in copper films is preserved during annealing, which leads to a shift of both peaks of the crystallite size distribution histograms to the larger sizes region. In contrast to Cu, micron-sized crystallites are present even in as-deposited Ag films besides the nanosized fraction. These grains are formed due to the phenomenon of self-annealing and weakly evolve during heating owing to grain growth stagnation. The nanosized fraction in as-deposited Ag films is represented by crystallites with the most probable size of 25 nm, which increases to 50 nm as a result of short-term annealing at the temperature of 250°C. The grain-boundary diffusion coefficient was determined, which is more than 10-18 m2/s for both films of metals. The obtained value indicates a multiple intensification of self-diffusion processes in films, the thickness of which allows us to refer them to macroscopic sample
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