单层覆盖层使Au薄膜的抗激光去湿性能接近最优
Monolayer Capping Provides Close to Optimal Resistance to Laser Dewetting of Au Films
AI总结:
本研究通过对比不同厚度覆盖层对Au薄膜激光去湿的影响,发现0.5-1 nm的Al或AlOx单层覆盖层能有效消除去湿,并提出基于能量学的模型指导覆盖层选择,以提升热稳定性。
摘要:
下一代热辅助磁记录(HAMR)依赖于写入过程中对磁介质的快速、局部加热。Au等离激元近场换能器是应对这一挑战的吸引人的解决方案,但需要提高Au薄膜的热稳定性以改善长期可靠性。本研究比较了纳米级Al、AlOx和Ta覆盖层对具有Ti或Ta粘附层的Au薄膜的影响,这些薄膜用于HAMR及其他高温等离激元应用。使用定制的激光去湿系统研究热稳定性,并广泛使用SEM和AFM来检查由此产生的去湿区域。发现最有效的覆盖层是0.5-1 nm的Al或AlOx,它们在某些条件下可以消除去湿。即使单层AlOx也被证明在减少去湿方面非常有效。对于较厚的Ta和AlOx覆盖层,Au薄膜容易在其下方去湿,留下完整的覆盖层。结论是较薄的覆盖层对去湿最有效,因为Au在去湿过程中无法在不破坏和拉开覆盖层的情况下进行去湿。基于能量学考虑开发了一个简单模型,该模型解释了较薄的覆盖层如何更有效地保护金属免受孔隙或裂缝的产生。该模型为给定金属选择基底和覆盖层提供了一些方便的指导方针,以最大化对激光诱导损伤的抵抗力。
英文摘要:
Next-generation heat-assisted magnetic recording (HAMR) relies on fast, localized heating of the magnetic medium during the write process. Au plasmonic near-field transducers are an attractive solution to this challenge, but increased thermal stability of Au films is required to improve long-term reliability. This work compares the effect of nanoscale Al, AlOx, and Ta capping films on Au thin films with Ti or Ta adhesion layers for use in HAMR and other high-temperature plasmonic applications. Thermal stability is investigated using a bespoke laser dewetting system, and SEM and AFM are extensively used to interrogate the resulting dewet areas. The most effective capping layers are found to be 0.5-1 nm of Al or AlOx, which can eliminate dewetting under certain conditions. Even one monolayer of AlOx is shown to be highly effective in reducing dewetting. In the case of thicker capping layers of Ta and AlOx, the Au film can easily dewet underneath, leaving an intact capping layer. It is concluded that thinner capping layers are most effective against dewetting as the Au cannot dewet without breaking them and pulling them apart during the dewetting process. A simple model based on energetics considerations is developed, which explains how thinner capping layers can more effectively protect the metal from pore or fissure creation. The model provides some convenient guidelines for choosing both the substrate and capping layer, for a given metal, to maximize the resistance to laser-induced damage.
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