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arXiv 2410.03340cond-mat.mes-hall
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基于干涉原子力显微镜的3D纳米级机电成像

3D Nanoscale Electromechanical Imaging with Interferometric Atomic Force Microscopy

Roger Proksch, Ryan Wagner

AI总结:

针对AFM力测量多局限于一维或二维且三维测量流程复杂的问题,提出一种精确干涉方法,可量化AFM针尖对局部力的完整三维响应,简化角分辨PFM技术,为基于AFM的力学测量提供通用框架。

摘要:

原子力显微镜(AFM)针尖与样品之间的作用力是三维的。尽管如此,大多数AFM力测量仍局限于一维或二维。此前,将AFM力测量扩展到三维需要复杂、困难且耗时的工作流程。在此,我们展示了一种精确的干涉方法,用于量化AFM针尖对局部力的完整三维响应。我们在一系列压电材料上演示了该方法,结果表明该方法可实现定量3D测量,且不受针尖下样品取向的影响。该方法简化了现有的角分辨压电响应力显微镜(PFM)技术。我们的测量得益于大幅降低的本底噪声(5 fm每根号赫兹)和干涉测量固有的精度。一个重要结果是,垂直压电灵敏度系统地比面内压电灵敏度大2至3倍。由于样品的杨氏(垂直)模量和剪切(横向)模量不同,对垂直和横向接触刚度的简单分析得出了2.5的系数,与测量结果吻合良好。虽然这项工作仅限于铁电材料,但它为其他基于AFM的力学测量提供了通用的工作流程和框架。

英文摘要:

Forces acting between an Atomic Force Microscope (AFM) tip and sample are three dimensional. Despite this, most AFM force measurements are confined to one or two dimensions. Extending AFM force measurements into three dimensions has previously required complex, difficult and time-consuming workflows. Here, we demonstrate an accurate, interferometric method for quantifying the full, three-dimensional response of an AFM tip to localized forces. We demonstrate this approach on a series of piezoelectric materials and show that this approach yields quantitative 3D measurement independent of the sample orientation beneath the tip. This approach simplifies existing, angle-resolved piezoresponse force microscopy (PFM) techniques. Our measurements benefit from the greatly reduced noise floor (5 fm per root Hz) and intrinsic accuracy of our interferometric measurements. One important result is that the vertical piezo sensitivity was systematically 2 to 3 times larger than the in-plane piezo sensitivities. A simple analysis of vertical and lateral contact stiffnesses, due to the difference in the Young (vertical) and Shear (lateral) sample yields a factor of 2.5, in good agreement with the measurements. While this work was confined to ferroelectric materials, it provides a general workflow and framework for other AFM based mechanical measurements.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

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