逾渗导电聚合物复合材料的焦阻响应
Pyroresistive response of percolating conductive polymer composites
AI总结：
通过无网格热弹性模拟，揭示导电聚合物复合材料中聚合物与导电填料热膨胀失配产生的局部应变导致逾渗网络电接触全局断开，从而引发导体-绝缘体转变的微观机制。
摘要：
导电聚合物复合材料（CPCs）的焦阻响应因其在众多电子器件中的潜在应用而引起了广泛关注，这些器件需要对温度或电场等外部物理参数的变化具有显著的响应能力。尽管已有大量研究致力于探究聚合物基体和导电填料的性质如何影响正温度系数焦阻效应，但人们对支配这一现象的微观机制的理解仍不完整。特别是迄今为止，专门研究聚合物热膨胀对导电相电连通性影响的理论工作还很少。在此，我们展示了对模型CPCs的模拟结果，其中刚性导电填料分散在绝缘的非晶态基体中。通过采用无网格算法分析系统的热弹性响应，我们将计算得到的应变场与逾渗导电粒子的电连通性耦合起来。我们表明，电导率响应由聚合物相与导电相热膨胀失配所产生的局部应变，并且导体-绝缘体转变是由构成逾渗网络的电接触发生突然且全局性的断开所引起的。
英文摘要：
The pyroresistive response of conductive polymer composites (CPCs) has attracted much interest because of its potential applications in many electronic devices requiring a significant responsiveness to changes in external physical parameters such as temperature or electric fields. Although extensive research has been conducted to study how the properties of the polymeric matrix and conductive fillers affect the positive temperature coefficient pyroresistive effect, the understanding of the microscopic mechanism governing such a phenomenon is still incomplete. In particular, to date, there is little body of theoretical research devoted to investigating the effect of the polymer thermal expansion on the electrical connectivity of the conductive phase. Here, we present the results of simulations of model CPCs in which rigid conductive fillers are dispersed in an insulating amorphous matrix. By employing a meshless algorithm to analyze the thermoelastic response of the system, we couple the computed strain field to the electrical connectedness of the percolating conductive particles. We show that the electrical conductivity responds to the local strains that are generated by the mismatch between the thermal expansion of the polymeric and conductive phases and that the conductor-insulator transition is caused by a sudden and global disconnection of the electrical contacts forming the percolating network.
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