一种用于二维材料及其异质结构的大规模、无刻蚀和超洁净转移与组装的挥发性聚合物印章
A volatile polymer stamp for large-scale, etching-free, and ultraclean transfer and assembly of two-dimensional materials and its heterostructures
AI总结：
提出挥发性聚合物印章（VPS）技术，利用PPA和PS实现二维材料及其异质结构的大规模、无刻蚀、超洁净转移与组装，解决了传统方法中的化学刻蚀、溶液撕裂和聚合物残留污染问题。
摘要：
二维（2D）材料及其异质结构的完整转移和组装对于将其集成到先进电子和光学器件中至关重要。在此，我们报告了一种称为挥发性聚合物印章（VPS）的简便技术，以实现2D材料的高效转移和具有清洁界面的大规模异质结的组装。VPS技术的核心特征是使用挥发性聚苯醛（PPA）和疏水性聚苯乙烯（PS）。由于水的插层，PS能够实现2D材料从亲水性基底上的直接剥离，而PPA可以保护2D材料免受溶液侵蚀，并在PS去除过程中保持其完整性。此后，PPA可以通过在180 °C下的热退火完全去除。所提出的VPS技术克服了当前使用的转移技术的局限性，例如剥离阶段的化学刻蚀、清洗过程中的溶液撕裂以及聚合物残留物的污染。
英文摘要：
The intact transfer and assembly of two-dimensional (2D) materials and their heterostructures are critical for their integration into advanced electronic and optical devices. Herein, we report a facile technique called volatile polymer stamping (VPS) to achieve efficient transfer of 2D materials and assembly of large-scale heterojunctions with clean interfaces. The central feature of the VPS technique is the use of volatile polyphthalaldehyde (PPA) together with hydrophobic polystyrene (PS). While PS enables the direct delamination of 2D materials from hydrophilic substrates owing to water intercalation, PPA can protect 2D materials from solution attack and maintain their integrity during PS removal. Thereafter, PPA can be completely removed by thermal annealing at 180 °C. The proposed VPS technique overcomes the limitations of currently used transfer techniques, such as chemical etching during the delamination stage, solution tearing during cleaning, and contamination from polymer residues.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
