QuickSim：硅悬空键合逻辑的高效精确物理模拟
QuickSim: Efficient and Accurate Physical Simulation of Silicon Dangling Bond Logic
摘要：
硅悬挂键已经成为超越CMOS技术领域的一个有前途的竞争对手。它们的集成密度和潜在的能量耗散优势超过传统电路技术的几个数量级，引发了学术界和工业界的兴趣。虽然制造能力迅速发展，第一个设计自动化方法已经提出，物理模拟的有效性还没有跟上。在这个领域建立的算法要么遭受指数运行时行为或低于标准的准确性水平。在这项工作中，我们提出了一种新的算法的物理模拟的硅悬空键系统的基础上，统计方法，提供了一个时间的解决方案和准确性的优势，超过国家的最先进的一个数量级和三个以上的因素，分别证明了一个详尽的实验评估。
英文摘要：
Silicon Dangling Bonds have established themselves as a promising competitor in the field of beyond-CMOS technologies. Their integration density and potential for energy dissipation advantages of several orders of magnitude over conventional circuit technologies sparked the interest of academia and industry alike. While fabrication capabilities advance rapidly and first design automation methodologies have been proposed, physical simulation effectiveness has yet to keep pace. Established algorithms in this domain either suffer from exponential runtime behavior or subpar accuracy levels. In this work, we propose a novel algorithm for the physical simulation of Silicon Dangling Bond systems based on statistical methods that offers both a time-to-solution and an accuracy advantage over the state of the art by more than one order of magnitude and a factor of more than three, respectively, as demonstrated by an exhaustive experimental evaluation.
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