大面积二维晶体等离子体激元激活的一步剥离方法
One-step exfoliation method for plasmonic activation of large-area 2D crystals
摘要：
先进的剥离技术对于探索2D材料的内在性质和应用至关重要。虽然最近发现的Au增强剥离技术为制备大规模2D晶体提供了有效的策略，但金的高成本阻碍了该方法在工业应用中的广泛采用。此外，直接金接触可以显着淬灭光致发光（PL）发射的二维半导体。因此，找到可以取代金的替代金属以实现2D材料的有效剥离至关重要。在这里，我们提出了一个一步银辅助的方法，可以有效地剥离许多大面积的2D单层，其中的产率是可比的金增强剥离方法。与Au膜不同的是，在SiO2/Si衬底上制备的Ag膜表面粗糙度更高，这有利于在粗糙Ag表面形成纳米结构而产生表面等离子体激元。更有趣的是，2D半导体晶体（例如MoS 2，MoSe 2）和Ag膜之间的强耦合导致了在其他机械剥离技术中未观察到的独特的PL增强，这主要归因于由于表面等离子体激元（SPP）的扩展传播而增强的光-物质相互作用。我们的工作提供了一种低成本和通用的银辅助剥离方法，同时提供增强的SPP物质相互作用。
英文摘要：
Advanced exfoliation techniques are crucial for exploring the intrinsic properties and applications of 2D materials. Though the recently discovered Au-enhanced exfoliation technique provides an effective strategy for preparation of large-scale 2D crystals, the high cost of gold hinders this method from being widely adopted in industrial applications. In addition, direct Au contact could significantly quench photoluminescence (PL) emission in 2D semiconductors. It is therefore crucial to find alternative metals that can replace gold to achieve efficient exfoliation of 2D materials. Here, we present a one-step Ag-assisted method that can efficiently exfoliate many large-area 2D monolayers, where the yield ratio is comparable to Au-enhanced exfoliation method. Differing from Au film, however, the surface roughness of as-prepared Ag films on SiO2/Si substrate is much higher, which facilitates the generation of surface plasmons resulting from the nanostructures formed on the rough Ag surface. More interestingly, the strong coupling between 2D semiconductor crystals (e.g. MoS2, MoSe2) and Ag film leads to a unique PL enhancement that has not been observed in other mechanical exfoliation techniques, which can be mainly attributed to enhanced light-matter interaction as a result of extended propagation of surface plasmonic polariton (SPP). Our work provides a lower-cost and universal Ag-assisted exfoliation method, while at the same offering enhanced SPP-matter interactions.
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