通过位移放大的电容式温度传感
Capacitive temperature sensing via displacement amplification
摘要：
我们提出了基于位移放大概念的电容式温度传感器的实现。我们的设计采用两个高热膨胀系数（CTE）金属层，中间由一个低CTE介电层隔开;导电层和介电层之间由一个薄的气隙隔开，并在几个位置粘合在一起。随着温度的升高，高CTE层倾向于比低CTE层膨胀得更多。由于对低CTE层施加的平面膨胀的约束，这导致高CTE层的大的平面外位移-因此位移放大项。在我们的情况下，高CTE层会导致导电层和介电层之间的间隙减小;反过来，这会导致电容的大幅变化。首先，我们通过数值模拟来说明这个概念。然后，我们实现了一个低成本的原型，这样的传感器使用铝箔作为导体，纸作为电介质，并通过粘合层在一起与氰基丙烯酸酯。我们的研究结果表明，这种简单的设计作为一种高效，低成本的温度传感器的路线的潜力。
英文摘要：
We propose the realization of capacitive temperature sensors based on the concept of displacement amplification. Our design features two high coefficient of thermal expansion (CTE) metallic layers separated by a low-CTE dielectric layer; conductive and dielectric layers are then separated by a thin air gap and glued together at a few locations. As the temperature increases, the high-CTE layer tends to expand more than the low-CTE one. Owing to the constraint to planar expansion imposed by the low-CTE layer, this results in large out-of-plane displacements of the high-CTE layer -- hence the displacement amplification term. In our case, the high-CTE layer buckles and causes a reduction of the gap between conductive and dielectric layers; in turn, this results in a large change of capacitance. First, we illustrate the concept via numerical simulations. Then, we realize a low-cost prototype of such sensor by using aluminum foil as conductor, paper as dielectric, and by gluing the layers together with cyanoacrylate. Our results demonstrate the potential of this simple design as a route towards efficient and low-cost temperature sensors.
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