增材制造中微流体-粉末耦合动力学的通用SPH建模框架：粘结剂喷射、材料喷射、定向能量沉积和粉末床熔合
A Versatile SPH Modeling Framework for Coupled Microfluid-Powder Dynamics in Additive Manufacturing: Binder Jetting, Material Jetting, Directed Energy Deposition and Powder Bed Fusion
摘要：
许多增材制造（AM）技术依赖于粉末原料，粉末原料通过熔化或通过化学结合与随后的烧结而熔融形成最终部件。在这两种情况下，工艺稳定性和所得零件质量取决于粉末颗粒和流体相之间的动态相互作用，即，熔融金属或液体粘合剂。目前的工作提出了一个通用的计算建模框架，用于模拟这种耦合的微流体粉末动力学问题，涉及热毛细流动和可逆相变。特别是，液相和气相与由基材和可移动粉末颗粒组成的固相相互作用，同时考虑温度依赖的表面张力和润湿效应。在激光-金属相互作用的情况下，通过附加的机械和热界面通量来合并快速蒸发的效果。所有的相域空间离散使用光滑粒子流体动力学。该方法的拉格朗日性质是有益的，在动态变化的接口拓扑结构的上下文中。特别注意的是在制定的相变，这是至关重要的计算方案的鲁棒性。虽然基本模式方程是一个非常一般的性质，建议的框架是特别适合于中尺度模拟各种AM过程。为此，计算建模框架的一般性和鲁棒性证明了几个应用程序的动机的例子，代表特定的AM工艺粘合剂喷射，材料喷射，定向能量沉积，和粉末床融合。除其他外，它示出了如何在粘合剂喷射或蒸发引起的反冲压力在粉末床融合液滴的动态影响导致粉末运动，变形的粉末包装结构，和粉末颗粒喷射。
英文摘要：
Many additive manufacturing (AM) technologies rely on powder feedstock, which is fused to form the final part either by melting or by chemical binding with subsequent sintering. In both cases, process stability and resulting part quality depend on dynamic interactions between powder particles and a fluid phase, i.e., molten metal or liquid binder. The present work proposes a versatile computational modeling framework for simulating such coupled microfluid-powder dynamics problems involving thermo-capillary flow and reversible phase transitions. In particular, a liquid and a gas phase are interacting with a solid phase that consists of a substrate and mobile powder particles while simultaneously considering temperature-dependent surface tension and wetting effects. In case of laser-metal interactions, the effect of rapid evaporation is incorporated through additional mechanical and thermal interface fluxes. All phase domains are spatially discretized using smoothed particle hydrodynamics. The method's Lagrangian nature is beneficial in the context of dynamically changing interface topologies. Special care is taken in the formulation of phase transitions, which is crucial for the robustness of the computational scheme. While the underlying model equations are of a very general nature, the proposed framework is especially suitable for the mesoscale modeling of various AM processes. To this end, the generality and robustness of the computational modeling framework is demonstrated by several application-motivated examples representing the specific AM processes binder jetting, material jetting, directed energy deposition, and powder bed fusion. Among others, it is shown how the dynamic impact of droplets in binder jetting or the evaporation-induced recoil pressure in powder bed fusion leads to powder motion, distortion of the powder packing structure, and powder particle ejection.
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