基于积分方程的双带堆叠超颖表面设计
The Design of Dual Band Stacked Metasurfaces Using Integral Equations
摘要：
提出了一种基于积分方程的设计一维不变双带堆叠元表面的方法。堆叠的超颖表面将在反射时在每个带中以期望的角度生成准直光束。背衬导体的堆叠超颖表面由一个堆叠在另一个上的两个超颖表面（由电介质间隔物支撑的图案化金属覆层）组成。堆叠的元表面分三个阶段设计。首先，每个超颖表面的图案化金属覆层被均匀化并建模为非均匀阻抗片。编写电场积分方程（EFIE）以对每个超颖表面内的均匀化元件之间以及从超颖表面到超颖表面的互耦合进行建模。利用矩量法将EFIE转化为矩阵方程。非线性矩阵方程在两个频段迭代求解，得到双频段复值阻抗片。在第二阶段中，应用优化来将这些复值阻抗片转换成适合于印刷电路板制造的纯电抗片，通过引入表面波。在第三阶段中，每个超颖表面的金属覆层被图案化以用于双带堆叠超颖表面的全波模拟。利用这种方法，设计了两个双波段堆叠元表面
英文摘要：
An integral equation-based approach for the design of dual band stacked metasurfaces which are invariant in one-dimension is presented. The stacked metasurface will generate collimated beams at desired angles in each band upon reflection. The conductor-backed stacked metasurface consists of two metasurfaces (a patterned metallic cladding supported by a dielectric spacer) stacked one upon the other. The stacked metasurface is designed in three phases. First the patterned metallic cladding of each metasurface is homogenized and modeled as an inhomogeneous impedance sheet. An Electric Field Integral Equation (EFIE) is written to model the mutual coupling between the homogenized elements within each metasurface, and from metasurface to metasurface. The EFIE is transformed into matrix equations by the method of moments. The nonlinear matrix equations are solved at both bands iteratively resulting in dual band complex-valued impedance sheets. In the second phase, optimization is applied to transform these complex-valued impedance sheets into purely reactive sheets suitable for printed circuit board fabrication by introducing surface waves. In the third phase, the metallic claddings of each metasurface are patterned for full-wave simulation of the dual band stacked metasurface. Using this approach, two dual band stacked metasurfaces are designed
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