使用扫描热探针量化加热微器件的温度
Quantifying the Temperature of Heated Microdevices Using Scanning Thermal Probes
摘要：
对微器件的温度进行量化对于探测纳米尺度的能量传输是至关重要的，这种量化通常通过将电阻温度计集成到微器件中来实现。然而，这样的温度计经常变得结构不稳定，并且由于在升高的温度下的热应力而失效。在这里，我们展示了定制的扫描热探针（STP），具有尖锐的尖端和集成的加热器/温度计，可以准确地测量在高温下保持的微器件的温度。该测量方法是在微器件与STP的针尖接触后，向STP引入调制热输入，并表征STP温度的直流和交流分量，通过简单的集总电容模型，从这些测得的温度分量中推导出针尖到样品的热阻和微器件表面温度。这里提出的进步可以大大方便各种加热的微型器件的温度测量。
英文摘要：
Quantifying the temperature of microdevices is critical for probing nanoscale energy transport.Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become structurally unstable and fail due to thermal stresses at elevated temperatures. Here, we show that custom-fabricated scanning thermal probes (STPs) with a sharp tip and an integrated heater/thermometer can accurately measure the temperature of microdevices held at elevated temperatures. This measurement is accomplished by introducing a modulated heat input to the STP after contacting the microdevice with the STP's tip, and characterizing the DC and AC components of the STP's temperature.From these measured temperature components, the tip-to-sample thermal resistance and the microdevice surface temperature are deduced via a simple lumped-capacitance model. The advances presented here can greatly facilitate temperature measurements of a variety of heated microdevices.
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