arXivDaily arXiv每日学术速递 周一至周五更新
北美退伍军人节(Veterans Day),12 日无更新
arXiv 2102.00943cond-mat.mtrl-sciphysics.atm-clus
收藏

Cu/Si体系ReaxFF反应力场的建立及其在Cu在硅中扩散形成铜团簇形成中的应用

ReaxFF Reactive Force Field Development for Cu/Si Systems and application to Copper Cluster Formation During Cu Diffusion Inside Silicon

Kamyar Akbari Roshan, Mahdi Khajeh Talkhoncheh, Jonathan E. Mueller, William A. Goddard, Adri C. T. van Duin

摘要:

硅等固态材料中的镍、铜和铁等过渡金属杂质对集成电路和太阳能电池的电气性能有重大影响。为了研究块体硅内部的铜杂质对材料的电性能的影响,需要了解硅晶格内部的铜原子的构型空间。在这项工作中,我们进行了ReaxFF反应力场为基础的分子动力学模拟,研究不同的配置的个别和晶体铜原子内的块体硅中的铜的扩散行为。ReaxFF Cu/Si参数集是通过对DFT数据进行训练而开发的,包括硅晶格内单个Cu原子的能垒。我们发现铜原子的扩散与温度有着直接的关系。此外,它也表明,个别铜原子开始集群内体硅在高温下。我们的模拟结果提供了一个全面的图片的温度和铜浓度对硅晶格内的单个铜的结晶的影响。最后,得到了Cu/Si化合物在单轴拉伸载荷下的应力-应变关系。我们的研究结果表明,随着Cu杂质浓度的增加,弹性模量降低。我们观察到自发微裂纹的Si在应力-应变测试过程中作为一个小的Cu簇邻近Si表面的形成的结果。

英文摘要:

Transition metal impurities such as nickel, copper, and iron, in solid-state materials like silicon have a significant impact on the electrical performance of integrated circuits and solar cells. To study the impact of copper impurities inside bulk silicon on the electrical properties of the material, one needs to understand the configurational space of copper atoms incorporated inside the silicon lattice. In this work, we performed ReaxFF reactive force field based molecular dynamics simulations, studying different configurations of individual and crystalline copper atoms inside bulk silicon by looking at the diffusional behavior of copper in silicon. The ReaxFF Cu/Si parameter set was developed by training against DFT data, including the energy barrier for an individual Cu-atom inside a silicon lattice. We found that the diffusion of copper atoms has a direct relationship with the temperature. Moreover, it is also shown that individual copper atoms start to clusterize inside bulk silicon at elevated temperatures. Our simulation results provide a comprehensive picture of the effects of temperature and copper concentration on the crystallization of individual copper inside silicon lattice. Finally, the stress-strain relationship of Cu/Si compounds under uniaxial tensile loading have been obtained. Our results indicate a decrease in the elastic modulus with increasing level of Cu-impurity concentration. We observe spontaneous microcracking of the Si during the stress-strain tests as a consequence of the formation of a small Cu clusters adjacent to the Si surface.

机构、总结、中文摘要均由AI分析而来,可能存在错误,请以论文正文为准。

↑