用于铜/金刚石复合材料热导率增强的可扩展单层功能化纳米界面
Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper/diamond composite
AI总结：
本研究提出在高温烧结前应用自组装单层（SAM）功能化纳米界面，显著提升了铜/金刚石复合材料的热边界导率与热导率，室温下热导率达711 W/m-K，为同类材料最高值。
摘要：
旨在开发高热导率铜/金刚石复合材料，一种在铜/金刚石复合材料高温烧结前应用自组装单层（SAM）的非传统方法被用于增强铜与金刚石之间的热边界导率（TBC）。该增强效果首先在模型界面系统上通过详细的SAM形貌表征和TBC测量得到系统性确认。TBC显著依赖于SAM覆盖度和有序度，高质量SAM的形成将TBC从无SAM时的27 MW/m^2-K提升至73 MW/m^2-K。借助分子动力学模拟，TBC增强被确认取决于SAM桥的数量与振动态密度的重叠。尺寸为210微米的金刚石颗粒在模型系统中产生最高TBC的条件下同时被SAM功能化，并与铜一起烧结以制备体积分数为50%的各向同性铜/金刚石复合材料。在室温下测得的热导率达到711 W/m-K，是具有相似金刚石颗粒体积分数和尺寸的材料中的最高值。这项工作展示了一种通过SAM功能化增强复合材料热导率的新颖策略。
英文摘要：
Aiming at developing high thermal conductivity copper/diamond composite, an unconventional approach applying self-assembled monolayer (SAM) prior to the high-temperature sintering of copper/diamond composite was utilized to enhance the thermal boundary conductance (TBC) between copper and diamond. The enhancement was first systematically confirmed on a model interface system by detailed SAM morphology characterization and TBC measurements. TBC significantly depends on the SAM coverage and ordering, and the formation of high-quality SAM promoted the TBC to 73 MW/m^2-K from 27 MW/m^2-K, the value without SAM. With the help of molecular dynamics simulations, the TBC enhancement was identified to be determined by the number of SAM bridges and the overlap of vibrational density of states. The diamond particles of 210 {\micro\metre} in size were simultaneously functionalized by SAM with the condition giving the highest TBC in the model system and sintered together with the copper to fabricate isotropic copper/diamond composite of 50% volume fraction. The measured thermal conductivity marked 711 W/m-K at room temperature, the highest value among the ones with similar diamond-particles volume fraction and size. This work demonstrates a novel strategy to enhance the thermal conductivity of composite materials by SAM functionalization.
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