Cu-Al系反应互扩散初期的原位透射电镜研究
Investigation of the early stage of reactive interdiffusion in the Cu-Al system by in-situ transmission electron microscopy
摘要：
利用原位透射电镜研究了350 { \textdegree }C和300 { \textdegree }C下Cu-Al系反应互扩散的早期阶段。一个特殊的照顾，找到条件下，电子束和样品的自由表面不显着影响反应。一个特别强调的是，然后给出了快速扩散路径的晶界的影响，并在纳米尺度的粒子，可能与转换前的相互作用。有人发现，有一个瞬态，然后是一个稳定的状态，其中金属间化合物的平均生长速率遵循抛物线规律，表明动力学是扩散控制。由于在纳米尺度上的原位观测，还可以跟踪不同相之间界面的局部速度。在小于100 nm的长度尺度内表现出强烈的波动，它们部分归因于纳米尺度颗粒的界面钉扎。最后，考虑到热力学和动力学参数，它主要是一个间接的影响引起的局部变化的溶质通量和浓度梯度。
英文摘要：
The early stage of the reactive interdiffusion in the Cu-Al system was investigated at 350 {\textdegree}C and 300 {\textdegree}C thanks to in-situ transmission electron microscopy. A special care was given to find conditions where the electron beam and the sample free surface do not affect significantly the reaction. A special emphasis was then given on the influence of grain boundaries that are fast diffusion paths, and on nanoscaled particles that may interact with the transformation front. It was found that there is a transient state followed by a steady state where the mean growth rates of intermetallic compounds follow a parabolic law indicating that the kinetics is diffusion controlled. Thanks to the in-situ observations at the nanoscale, it was also possible to track the local velocity of interfaces between the different phases. Strong fluctuations were exhibited within length scales smaller than 100 nm and they are partly attributed to interface pinning by nanoscaled particles. Last, considering thermodynamic and kinetic arguments, it is shown that it is mainly an indirect effect induced by a local change of solute fluxes and of concentration gradients.
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