2025年及以后的超大规模设计自动化（ESDA）挑战和机遇研讨会
Workshops on Extreme Scale Design Automation (ESDA) Challenges and Opportunities for 2025 and Beyond
摘要：
集成电路和电子系统，以及设计技术，正在以很大的速度发展-无论是数量上还是质量上。主要的发展包括具有原子尺度不确定性的新型互连和开关器件、片上集成的深度和规模、电子系统级集成、软件的日益重要性，以及更有效的设计输入、编译、算法优化、数值模拟、硅设计前后验证和芯片测试手段。应用目标和关键市场也在从桌面CPU到移动平台再到物联网基础设施的重大转变。鉴于电子设计环境的这些变化以及EDA对这些环境的显著依赖，EDA社区必须适应这些变化，并专注于研究和商业成功的机会。在ACM SIGDA的支持下组织的CCC极限规模设计自动化系列研讨会研究了EDA社区面临的挑战以及当前可用的新的令人兴奋的机会。本文件是这些会议的结论摘要。
英文摘要：
Integrated circuits and electronic systems, as well as design technologies, are evolving at a great rate -- both quantitatively and qualitatively. Major developments include new interconnects and switching devices with atomic-scale uncertainty, the depth and scale of on-chip integration, electronic system-level integration, the increasing significance of software, as well as more effective means of design entry, compilation, algorithmic optimization, numerical simulation, pre- and post-silicon design validation, and chip test. Application targets and key markets are also shifting substantially from desktop CPUs to mobile platforms to an Internet-of-Things infrastructure. In light of these changes in electronic design contexts and given EDA's significant dependence on such context, the EDA community must adapt to these changes and focus on the opportunities for research and commercial success. The CCC workshop series on Extreme-Scale Design Automation, organized with the support of ACM SIGDA, studied challenges faced by the EDA community as well as new and exciting opportunities currently available. This document represents a summary of the findings from these meetings.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
