固态限流器元件级冗余拓扑的可靠性分析
Reliability Analysis of Component Level Redundant Topologies for solid state Fault Current Limiter
摘要：
经验表明，电力电子系统中的半导体开关是最脆弱的部件。解决这一可靠性挑战的最常见方法之一是组件级冗余设计。部件级冗余设计有四种可能的配置。对固态故障限流器（SSFCL）的不同元件级冗余设计进行了可靠性比较分析。所提出的分析的目的是确定更可靠的组件级冗余配置。平均无故障时间（MTTF）被用作可靠性参数。考虑两种故障类型（开路和短路），不同的配置的MTTF计算。它表明，更可靠的配置取决于半导体开关的结温在稳态。该结温是i）环境温度、ii）半导体开关的功率损耗和iii）散热器的热阻的函数。此外，结果对每个参数的敏感性进行了研究。结果表明，在不同的条件下，各种配置具有较高的可靠性。实验结果阐明了所提出的方法的理论和可行性。最后，对不同配置的平准化成本进行了分析比较。
英文摘要：
Experience shows that semiconductor switches in power electronics systems are the most vulnerable components. One of the most common ways to solve this reliability challenge is component-level redundant design. There are four possible configurations for the redundant design in component-level. This paper presents a comparative reliability analysis between different component-level redundant designs for solid state fault current limiter (SSFCL). The aim of the proposed analysis is to determine the more reliable component-level redundant configuration. The mean time to failure (MTTF) is used as the reliability parameter. Considering both fault types (open circuit and short circuit), the MTTFs of different configurations are calculated. It is demonstrated that more reliable configuration depends on the junction temperature of the semiconductor switches in the steady state. That junction temperature is a function of i) ambient temperature, ii) power loss of the semiconductor switch and iii) thermal resistance of heat sink. Also, results sensitivity to each parameter is investigated. The results show that in different conditions, various configurations have higher reliability. The experimental results are presented to clarify the theory and feasibility of the proposed approaches. At last, levelized costs of different configurations are analyzed for a fair comparison.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
