A novel approach to building micromegas detectors enabled by precision manufacturing

A thermal bonding method for manufacturing Micromegas detectors

For manufacturing Micromegas detectors, the "bulk" method based on photoetching, was successfully developed and widely used in nuclear and particle physics experiments. However, the complexity of the method requires a considerable number of advanced instruments and processing, limiting the accessibility of this method for production of Micromegas detectors. In view of these limitations with the bulk method, a new method based on thermal bonding technique (TBM) has been developed to manufacture Micromegas detectors in a much simplified and efficient way without etching. This paper describes the…

New developments in Micromegas Microbulk detectors

A new Micromegas manufacturing technique, based on kapton etching technology, has been recently developed, improving the uniformity and stability of this kind of readouts. Excellent energy resolutions have been obtained, reaching 11% FWHM for the 5.9 keV photon peak of 55Fe source and 1.8% FWHM for the 5.5 MeV alpha peak of the 241Am source. The new detector has other advantages like its flexible structure, low material and high radio-purity. The two actual approaches of this technique will be described and the features of these readouts in argon-isobutane mixtures will be presented. Moreover,…

PandaX-III实验中热 bonding 微米格栅探测器增益均匀性优化

Optimization of gain uniformity in thermal bonding Micromegas for the PandaX-III experiment

通过优化热 bonding 薄膜在探测器边缘，提高PandaX-III实验中微米格栅探测器的增益均匀性，实现高压下高分辨率测量的潜力。

使用VMM3a ASIC的电阻式MPGDs pad读出性能

Performance of resistive MPGDs with pad readout coupled to VMM3a ASIC

本研究比较了Micromegas、RPWELL和$μ\mathrm{-RWELL}$三种电阻式MPGD技术配合VMM3a读出的性能，发现所有探测器效率均超96%，且各技术在不同实验条件下具有独特优势。

7焊盘电阻式PICOSEC Micromegas探测器的性能优化与表征

Performance Optimization and Characterization of 7-pad Resistive PICOSEC Micromegas Detectors

本研究通过测试不同电阻架构的PICOSEC Micromegas探测器原型，证明了电阻层技术可在不牺牲时间性能的前提下提升鲁棒性，并优化了时间与空间分辨率。