三维高阶拓扑声绝缘体中的多维声传播
Multidimensional sound propagation in 3D high-order topological sonic insulator
摘要：
高阶拓扑绝缘体（TI）的出现发展了传统的体-边界对应理论，引起了人们对新型拓扑材料的研究兴趣。为了实现具有宽通带的1D和2D传输模式的高阶TI，我们设计了非平凡和平凡的3D声波晶体，其组合模仿Su-Schrieffer-Heeger模型。在界面处可以发现高阶拓扑边界态，包括0 D角点态、1D铰链态和2D表面态。制作的弯曲的二维和一维声道的样品表现出多维的声音在空间中的传播，也验证了完整的带隙，铰链状态，和表面状态之间的整体带隙内的过渡。其中，单模铰链状态的带宽实现了大的相对带宽9.1%，其中声音传输一维没有显着泄漏到表面或散装。研究中的高阶拓扑状态为空间中的多维声音操纵铺平了道路。
英文摘要：
High-order topological insulators (TIs) develop the conventional bulk-boundary correspondence theory and rise the interest in searching innovative topological materials. To realize a high-order TI with a wide passband of 1D and 2D transportation modes, we design non-trivial and trivial 3D sonic crystals whose combination mimics the Su-Schrieffer-Heeger model. The high-order topological boundary states can be found at the interfaces, including 0D corner state, 1D hinge state, and 2D surface state. The fabricated sample with the bent two-dimensional and one-dimensional acoustic channels exhibits the multidimensional sound propagation in space, and also verifies the transition between the complete band gap, hinge states, and surface states within the bulk band gap. Among them, the bandwidth of the single-mode hinge state achieves a large relative bandwidth 9.1%, in which sound transports one-dimensionally without significant leak into the surfaces or the bulk. The high-order topological states in the study pave the way for multidimensional sound manipulation in space.
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