氧化和非氧化条件下机械制备铜表面
Mechanically prepared copper surface in oxidizing and non-oxidizing conditions
摘要：
在本工作中，通过接触式轮廓仪和分形分析，对经过机械表面处理工艺（抛光、研磨、喷砂）以及在700 ° C和750°C的非氧化性（高纯氩气）和氧化性（空气）条件下暴露后的铜样品的表面粗糙度进行了评估。通过分形分析可以定量描述传统方法看不到的表面，例如，在本工作中，氧化层下的Cu 2 O/Cu边界的粗糙度已被评估。已经指出，在氧化和非氧化条件下，铜的初始表面粗糙度都受到高温退火的影响：与热处理前的表面粗糙度相比，抛光和研磨样品在700°C下的表面粗糙度增加，但在750°C下的表面粗糙度降低。对于氧化和非氧化条件下的喷砂样品，在750°C下获得表面粗糙度参数的最低值。结果表明，铜与氧的化学反应和高温退火引起的铜表面扩散是造成这种效应的两个主要原因。
英文摘要：
In the present work surface roughness of copper samples after mechanical surface preparation processes (polishing, grinding, sand-blasting) and after exposure in non-oxidizing (high purity argon) and oxidizing (air) conditions at 700 and 750°C have been evaluated by contact profilometer and by fractal analysis. Quantitative description of surfaces that are hidden from the sight of conventional methods is possible by fractal analysis, e.g. in the present work, the roughness of Cu2O/Cu boundary has been evaluated under oxide layer. It has been pointed out, that in both oxidizing and non-oxidizing conditions initial surface roughness of copper is affected by annealing at high temperature: at 700°C surface roughness of polished and ground samples increased but at 750°C decreased in comparison to surface roughness prior to heat treatment. For sand-blasted samples in both oxidizing and non-oxidizing conditions the lowest values of surface roughness parameters were obtained at 750°C. It is then concluded that two phenomena are responsible for such effect: chemical reaction between copper and oxygen and surface diffusion of copper due to high temperature of annealing.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
