单颗粒Cu/Sn-3Ag-0.5Cu/Cu焊点热循环的原位电子背散射衍射
In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
摘要：
采用原位热循环结合电子背散射衍射（EBSD）技术研究了Cu/SAC 305/Cu单焊点组织的非均匀演化。由于热膨胀失配导致的局部变形导致异质晶格旋转，朝向接头的拐角局部化并且朝向接头的中心减小。这种变形是由界面处的\b{eta} -Sn、Cu 6Sn 5和Cu之间的CTE的约束引起的。在变形过程中，亚晶的形成伴随着取向差的持续增加，这意味着在应变局部化区域塑性滑移的积累以及滑移系统（1-10）[111]/2和（11-0）[111]/2的激活。
英文摘要：
The heterogeneous evolution of microstructure in a single Cu/SAC305/Cu solder joint is investigated using in-situ thermal cycling combined with electron backscatter diffraction (EBSD). Local deformation due to thermal expansion mismatch results in heterogeneous lattice rotation, localised towards the corners of the joint and decreases towards the centre of the joint. This deformation is induced by the constraint from the CTE between the \b{eta}-Sn, Cu6Sn5 and Cu at interfaces. The formation of subgrains with continuous increase in misorientation is revealed during deformation, implying the accumulation of plastic slip at the strain-localised regions and the activation of slip systems (1-10)[111]/2 and (11-0)[111]/2.
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