n型4H-SiC上laser退火形成的镍基欧姆接触的形貌和电学性能
Morphological and electrical properties of Nickel based Ohmic contacts formed by laser annealing process on n-type 4H-SiC
摘要：
本文研究了激光退火形成的SiC功率二极管镍基背面欧姆接触的形貌和电学性能。在重掺杂110 μ m4H-SiC基片机械研磨后的背面溅射了100 nm厚的Ni薄膜。然后，为了实现欧姆行为，用波长为310 nm、能量密度为4.7 J/cm 2和脉冲持续时间为160 ns的UV受激准分子激光照射金属膜。通过不同的技术手段分析样品的形态和结构特性。纳米尺度的导电原子力显微镜（C-AFM）的电分析允许相关的退火金属膜的形态与它们的局部电性能。研究了激光退火制备的接触的欧姆行为，并与标准快速热退火（RTA）工艺进行了比较。最后，将其集成到650V SiC肖特基二极管的制作中。
英文摘要：
This work reports on the morphological and electrical properties of Ni-based back-side Ohmic contacts formed by laser annealing process for SiC power diodes. Nickel films, 100 nm thick, have been sputtered on the back-side of heavily doped 110 um 4H-SiC thinned substrates after mechanical grinding. Then, to achieve Ohmic behavior, the metal films have been irradiated with an UV excimer laser with a wavelength of 310 nm, an energy density of 4.7 J/cm2 and pulse duration of 160 ns. The morphological and structural properties of the samples were analyzed by means of different techniques. Nanoscale electrical analyses by conductive Atomic Force Microscopy (C-AFM) allowed correlating the morphology of the annealed metal films with their local electrical properties. Ohmic behavior of the contacts fabricated by laser annealing have been investigated and compared with the standard Rapid Thermal Annealing (RTA) process. Finally, it was integrated in the fabrication of 650V SiC Schottky diodes.
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