用于通孔制造的DSA感知的多重图案化：与图着色问题、IP公式和数值实验的联系
DSA-aware multiple patterning for the manufacturing of vias: Connections to graph coloring problems, IP formulations, and numerical experiments
摘要：
在本文中，我们研究了集成电路中的过孔的制造与光刻和定向自组装（DSA）相结合的新技术。在这种新工艺中，优化生产时间和成本需要最小化光刻步骤的数量，这构成了图着色的一般化。我们开发整数规划配方的几个变量的兴趣在行业中，然后研究我们的配方在真正的工业实例的计算性能。我们表明，最好的整数规划公式实现了良好的计算性能，并指出潜在的方向，以进一步加快计算时间和开发生产可行的精确方法。
英文摘要：
In this paper, we investigate the manufacturing of vias in integrated circuits with a new technology combining lithography and Directed Self Assembly (DSA). Optimizing the production time and costs in this new process entails minimizing the number of lithography steps, which constitutes a generalization of graph coloring. We develop integer programming formulations for several variants of interest in the industry, and then study the computational performance of our formulations on true industrial instances. We show that the best integer programming formulation achieves good computational performance, and indicate potential directions to further speed-up computational time and develop exact approaches feasible for production.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
