分层介质中三维互连线宽带建模的完全表面积分法
A Complete Surface Integral Method for Broadband Modeling of 3D Interconnects in Stratified Media
摘要：
提出了一种快速、准确地模拟分层介质中互连线的表面积分方程求解器。本文提出了一种新的计算多层膜格林函数的方法。利用贝塞尔函数的泰勒展开式，将矩量法中索末菲积分的计算简化为简单的代数运算。为了模拟导体中的趋肤效应，将单源微分表面导纳算子推广到分层介质中的导体。为了处理大的现实结构，自适应积分方法开发的多层环境中的一个广义的方式，不构成任何限制的导体布局，不需要特殊的网格细化，不像以前的作品。所提出的方法是强大的在一个广泛的频率范围内与增广的电场积分方程。不同形状和电气尺寸的实际结构在很宽的频率范围内成功地进行了分析，并对商用有限元工具的结果进行了验证。
英文摘要：
A surface integral equation solver is proposed for fast and accurate simulation of interconnects embedded in stratified media. A novel technique for efficient computation of the multilayer Green's function is proposed. Using the Taylor expansion of Bessel functions, the computation of Sommerfeld integrals during the method of moments procedure is reduced to simple algebraic operations. To model skin effect in conductors, the single-source differential surface admittance operator is extended to conductors in stratified media. To handle large realistic structures, the adaptive integral method is developed for a multilayer environment in a generalized manner that poses no restrictions on layout of conductors, and requires no special grid refinement, unlike previous works. The proposed method is made robust over a wide frequency range with the augmented electric field integral equation. Realistic structures of different shapes and electrical sizes are successfully analyzed over a wide frequency range, and results are validated against a commercial finite element tool.
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