多孔层间界面热阻对多层多孔结构导热性的影响
Interfacial thermal resistance between porous layers: impact on thermal conductivity of a multilayered porous structure
摘要：
多层多孔硅纳米结构的热输运的特点被认为是。通过施加周期性变化的电流密度，通过电化学蚀刻单晶Si衬底来制造这种纳米结构。由此，形成了具有特定声子性质的多层结构。光声（PA）技术在气体麦克风配置应用于热导率的评价。实验的幅频依赖性进行了调整的温度分布模拟与导热系数的多层多孔结构作为拟合参数。实验测定的热导率值被发现是显着低于理论计算的。这种差异是与存在的热阻在多孔层之间的界面处，由于弹性参数失配（声学失配）所产生的不同的孔隙率。因此，这个界面热阻的大小进行了实验评估的第一次。此外，在多层多孔硅结构的热输运扰动的电阻的关键影响被揭示。
英文摘要：
Features of thermal transport in multilayered porous silicon nanostructures are considered. Such nanostructures were fabricated by electrochemical etching of monocrystalline Si substrates by applying periodically changed current density. Hereby, the multilayered structures with specific phononic properties were formed. Photoacoustic (PA) technique in gas-microphone configuration was applied for thermal conductivity evaluation. Experimental amplitude-frequency dependencies were adjusted by temperature distribution simulation with thermal conductivity of the multilayered porous structure as a fitting parameter. The experimentally determined values of thermal conductivity were found to be significantly lower than theoretically calculated ones. Such difference was associated with the presence of thermal resistance at the interfaces between porous layers with different porosities arising because of elastic parameters mismatch (acoustical mismatch). Accordingly, the magnitude of this interfacial thermal resistance was experimentally evaluated for the first time. Furthermore, crucial impact of the resistance on thermal transport perturbation in a multilayered porous silicon structure was revealed.
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