水介质中Si（111）的纳秒级laser烧蚀
Nanosecond laser ablation of Si(111) under an aqueous medium
摘要：
研究了纳秒激光烧蚀p型Si（111）晶片的实验条件。利用光学轮廓仪、扫描电子显微镜和原子力显微镜系统地分析了脉冲能量、脉冲数和环境类型对激光加工的影响。得到的结果进行了比较与Zemax-EE模拟。自组装纳米波纹的形成已被观察到在环境条件下。然而，这些波纹和热影响区（HAZ）面积消失，提高了烧蚀质量的水介质。此外，基于SEM-EDX分析，即使在环境条件下，在烧蚀区中也没有获得显著的氧化。用假彩色技术比较了不同环境下的烧蚀剖面和烧蚀深度。虽然烧蚀直径彼此相当，但它们的深度足够小以控制损伤区域的深度轮廓。根据我们的研究结果，最好的烧蚀轮廓（精确的边缘没有HAZ）下实现的水介质，特别是在甘油条件下，在低和高脉冲能量制度。
英文摘要：
Nanosecond laser ablation of p-type Si(111) wafer is presented under an ambient, a water and a glycerin conditions. Effects of pulse energy, number of pulses and type of environment are systematically analyzed with an Optical Profilometer, a Scanning Electron Microscope and an Atomic Force Microscope. Obtained results are compared with Zemax-EE simulations. Self-assembly nano-ripple formation has been observed in an ambient condition. However, these ripples and heat affected zone (HAZ) area disappeared in aqueous medium which enhances the quality of ablation. Moreover, no remarkable oxidation was obtained in ablation zone even in an ambient condition based on the SEM-EDX analysis. Ablation profiles and their depths for different environments are compared with false color technique. Although ablation diameters are comparable each other, their depths are small enough in aqueous medium to control depth profile of damaged area. According to our results, best ablation profiles (precise edges without HAZ) are achieved under an aqueous medium especially in glycerin conditions both in low and high pulse energy regime.
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